Curable functional expression paste, adhesive, encapsulation material, coating agent, cured product, semiconductor device, electronic component, and curing, bonding, encapsulating and coating methods using the curable functional expression paste

Abstract

The object of this invention is to provide a curable functional expression paste that exhibits excellent deep curing properties in a light-irradiation curing method, an adhesive, an encapsulation material or a coating agent, a cured product thereof, a semiconductor device or electronic component containing the cured product thereof, and a curing method, bonding method, encapsulation method and coating method using the curable functional expression paste. The invention provide a curable functional expression paste comprising (A) a polymer, (B) a Photopolymerization initiator, (C) a photosensitizer, and (D) an illuminant, (C) a photosensitizer is present in the curable functional paste such that it absorbs light with a wavelength greater than