Slurry, grinding method and manufacturing method of parts

TW202639771APending Publication Date: 2026-10-01RESONAC CORP
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Patent Information

Application Number
TW115101625
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-01-17
Filing Date
2026-01-15
Publication Date
2026-10-01
Patent Text Reader

Abstract

The slurry of this invention contains abrasive particles and water. The abrasive particles include cerium oxide particles, and the ratio of the BET specific surface area (SN) of the cerium oxide particles when nitrogen is used as the adsorption medium to the BET specific surface area (SW) of the cerium oxide particles when water is used as the adsorption medium is 0.68 or higher. The grinding method of this invention includes the step of grinding a workpiece using the slurry. The manufacturing method of the part of this invention includes the step of obtaining a part using a workpiece ground by the grinding method.
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