Slurry, grinding method and manufacturing method of parts
TW202639771APending Publication Date: 2026-10-01RESONAC CORP
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Patent Information
- Application Number
- TW115101625
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-01-17
- Filing Date
- 2026-01-15
- Publication Date
- 2026-10-01
Abstract
The slurry of this invention contains abrasive particles and water. The abrasive particles include cerium oxide particles, and the ratio of the BET specific surface area (SN) of the cerium oxide particles when nitrogen is used as the adsorption medium to the BET specific surface area (SW) of the cerium oxide particles when water is used as the adsorption medium is 0.68 or higher. The grinding method of this invention includes the step of grinding a workpiece using the slurry. The manufacturing method of the part of this invention includes the step of obtaining a part using a workpiece ground by the grinding method.
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