Light-curing adhesive composition, adhesive, adhesive-attached component, method for manufacturing adhesive, cured body, component, and method for manufacturing cured body.

TW202639773APending Publication Date: 2026-10-01NITTO DENKO CORP
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Patent Information

Application Number
TW114144102
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-28
Filing Date
2025-11-12
Publication Date
2026-10-01

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Abstract

The photocurable adhesive composition provided by this invention contains monomer component M, a photoinitiator, and a colorant. The content of organic solvent in the above-mentioned photocurable adhesive composition is less than 1% by weight. The colorant can be a black colorant. The adhesive formed from the above-mentioned photocurable adhesive composition can have a total light transmittance of less than 5% and a refractive index of 1.50 or higher. Although this photocurable adhesive composition contains a colorant, it is still suitable for suppressing poor curing.
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