Method for manufacturing protective tape for workpiece processing and semiconductor devices

Abstract

[Problem] To suppress insufficient curing caused by oxygen in an energy-curing adhesive, wherein the energy-curing adhesive contains an adhesive component having a (meth)acrylic group. [Solution] A protective tape for workpiece processing, comprising a substrate and an adhesive layer disposed on one side of the substrate, characterized in that the adhesive layer comprises: (A) an energy-curing adhesive component having a (meth)acrylic group; and (B) a compound having a maleic anhydride group.

Images