Composition for adhesive layer, method for producing layered product, and method for processing layered product

TW202639779APending Publication Date: 2026-10-01NIPPON STEEL CHEM & MATERIAL CO LTD
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Patent Information

Application Number
TW114139887
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-10-29
Filing Date
2025-10-16
Publication Date
2026-10-01

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Abstract

This invention provides an adhesive layer forming composition that exhibits excellent decomposability based on light irradiation during adhesive layer formation and reduces residue during decomposition, as well as a method for manufacturing a laminate containing the adhesive layer forming composition and a method for processing the laminate. An adhesive layer forming composition is provided in which light is irradiated from the support side in a laminate comprising an adhesive layer between a light-transmitting support and an adherend, thereby enabling separation of the support and the adherend from the laminate. The adhesive layer forming composition comprises: (A) a polymeric resin containing unsaturated groups; and (E) a solvent. The absorbance of the cured film obtained under specified conditions at a wavelength of 266 nm is 0.50 or more. The weight reduction rate of component (A) obtained under specified conditions is 50% by mass or more.
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