Wafer protection tape and method for manufacturing wafer protection tape

Abstract

The object of this invention is to provide a surface protection strip that can adequately fill the unevenness of a wafer surface and can be peeled off without damaging the wafer after back-side grinding. This object is achieved by the following strips: a strip for protecting the surface of a wafer during back-side grinding of a wafer with uneven surfaces, wherein the strip comprises a substrate layer and a thermoplastic resin layer, the thermoplastic resin layer being in contact with the wafer on the side opposite to the side where the substrate layer is located, and the O / C ratio of the aforementioned surface according to ESCA analysis is 18 × 10⁻³ to 54 × 10⁻³; and a strip for protecting the surface of a wafer during back-side grinding of a wafer with uneven surfaces, wherein the strip comprises a substrate layer and a thermoplastic resin layer, the thermoplastic resin layer being in contact with the wafer on the side opposite to the side where the substrate layer is located, and the water contact angle of the aforementioned surface is 90° to 103°.