Conductive resin compositions, conductive films, conductive materials, conductive adhesives, and circuit connection materials

Abstract

The present invention aims to provide a conductive resin composition capable of being heated in atmosphere and exhibiting conductivity equivalent to silver paste, as well as a conductive film with low volume resistivity formed from said conductive resin composition, a conductive material comprising said conductive resin composition, a conductive adhesive comprising said conductive resin composition, and a circuit connection material comprising said conductive resin composition. A conductive resin composition comprises (a) tin powder, (b) resin, and (c) a carboxylic acid compound, wherein the (b) resin comprises (b1) a polyvinyl acetal resin and / or (b2) an epoxy resin, and the (c) carboxylic acid compound is a compound whose pH is in the range of 2.0 or higher and 5.8 or lower, obtained by mixing and stirring 0.20 g of the carboxylic acid compound in 40.0 g of ion-exchanged water.