Insulating tape

Abstract

This invention provides an insulating tape with excellent transportability in the step of bonding a semiconductor element to a lead frame via an insulating tape. The insulating tape of this invention is as follows: an insulating tape (100) for insulation between a semiconductor element (21) and a lead frame (22), the insulating tape (100) having an insulating substrate (101) and a first bonding layer (13) for bonding the insulating substrate (101) and the lead frame (22), the insulating substrate (101) comprising a polyimide resin film, and when the surface static friction coefficient of the first bonding layer (13) is µ, the storage elastic modulus of the insulating tape (100) is E, and the thickness of the insulating tape (100) is t, µ / (E・t3) < 25000 N-1・m-1.

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