Thermally conductive polysiloxane composition and its manufacturing method

Abstract

A thermally conductive polysiloxane composition is provided, which exhibits high thermal conductivity, excellent workability and anti-displacement properties, and is manufactured under mild conditions that do not require heating above 50°C. The thermally conductive polysiloxane composition comprises a reactant of components (A) and (B) and component (C). (A) An organopolysiloxane having an organic group but no alkoxy group, wherein the organic group has an anhydride group bonded to silicon atoms, and the alkoxy group is bonded to silicon atoms; (B) An organopolysiloxane having an amino group; and (C) A thermally conductive filler.