Heat dissipation materials and semiconductor devices

TW202639801AInactive Publication Date: 2026-10-01METAL INDS RES & DEV CENT
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Patent Information

Application Number
TW114112051
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-03-28
Publication Date
2026-10-01
Estimated Expiration
Not applicable · inactive patent

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Abstract

The present disclosure relates to a heat dissipation material and a semiconductor device. The heat dissipation material includes a liquid multi-element alloy and a gallium-copper intermetallic compound powder. The liquid multi-element alloy includes
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