Organ-chip system and organ-chip package

Abstract

An organ-chip system comprises a box structure, an organ chip, a cover structure and at least one tube. The box structure has an opening and includes at least one partition wall, and the interior of the box structure is divided into a plurality of spaces by the at least one partition wall. The organ chip is adapted to being disposed inside the box structure, and the organ chip has at least one connecting hole adapted to being connected to a tube. The cover structure corresponds to the opening of the box structure and is adapted to being disposed on the box structure and covering the interior of the box structure. The cover structure has at least one through hole corresponding to the at least one connecting hole of the organ chip. The at least one tube is connected to the at least one connecting hole and the at least one through hole, and is adapted to allowing fluid to pass through.

Description

Technical Field

[0001] This invention relates to the field of bionic organs, and in particular to an organ wafer and the use of the organ wafer. Prior Technology

[0002] Organ wafers, as an in vitro platform, can be used for organoid culture and the construction of physiological and pathological models for research and pharmaceutical development. Manufacturer-supplied organ wafers are typically packaged in a box and then sealed in a sterile bag. When using them, the organ wafer is removed from the sterile bag and box, and the box and bag are then discarded. The use of organ wafers generally involves fluids, such as drug supply, gas exchange, and organ waste removal; therefore, their use also includes connecting external fluid lines to the organ wafer to realize its intended purpose. Summary of the Invention

[0003] This invention provides an organ wafer system that simplifies the operation of organ wafers.

[0004] The present invention also provides an organ wafer packaging that has a cushioning and shockproof effect and can be used for the handling of organ wafers.

[0005] To achieve one or more of the above-mentioned objectives, or other objectives, an embodiment of the present invention provides an organ wafer system, including a housing, an organ wafer, a cover, and at least one tubing. The housing has an opening and includes at least one partition wall, wherein the interior of the housing is divided into multiple spaces by the at least one partition wall. The organ wafer is adapted to be disposed inside the housing, wherein the organ wafer has at least one connection hole adapted to connect to the tubing. The cover corresponds to the opening of the housing and is adapted to be disposed on the housing and cover the interior of the housing, wherein the cover has at least one through-hole corresponding to at least one connection hole of the organ wafer. The at least one tubing is connected to the at least one connection hole and the at least one through-hole, and is adapted to allow fluid to pass through.

[0006] An embodiment of the present invention also provides an organ wafer packaging, including a packaging structure and an organ wafer, wherein the packaging structure includes a box body and a lid. The box body is formed of a cushioning material and has an opening, wherein the cushioning material forms a support structure inside the box body. The lid corresponds to the opening of the box body and is disposed on the box body, covering the interior of the box body. The organ wafer is housed within the packaging structure and supported on the support structure.

[0007] This invention employs a box and a lid, with the organ wafer disposed inside the box. The lid has a through-hole, and the interior of the box is divided into multiple spaces. The through-hole of the lid corresponds to the connector of the organ wafer and can be connected to a tube. Therefore, the operation is simplified by closing the lid onto the box. Furthermore, because the box is made of cushioning material, and the cushioning material forms a support structure inside the box, it can serve as a packaging structure and provide support and shock absorption for the organ wafer.

[0008] To make the above and other objects, features and advantages of the present invention more apparent and understandable, specific embodiments are described below in conjunction with the accompanying drawings for detailed explanation. Simple Explanation of the Diagram

[0009] Figure 1 shows an exploded view of an organ wafer system according to an embodiment of the present invention. Figure 2 shows a schematic diagram of the combination of Figure 1. Figure 3 shows a three-dimensional schematic diagram of an organ wafer system according to another embodiment of the present invention. Figure 4 shows an exploded view of an organ wafer packaging according to an embodiment of the present invention. Implementation

[0010] The foregoing descriptions and other technical contents, features, and effects of this invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The directional terms mentioned in the following embodiments are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for illustrative purposes and not for limiting the invention. Furthermore, the terms "first," "second," etc., mentioned in this specification or the claims are only used to name elements or distinguish different embodiments or scopes, and are not used to limit the upper or lower limit of the number of elements.

[0011] Figure 1 shows an exploded view of an organ wafer system according to an embodiment of the present invention, and Figure 2 is an assembled view of Figure 1. As shown in Figures 1 and 2, the organ wafer system 1 of the present invention includes a housing 100, a cover 200, and organ wafers 300. The organ wafers 300 are disposed inside the housing 100, and the number of them can be one or more. The cover 200 can close onto the opening 101 of the housing 100 from above and cover the interior of the housing 100. In Figure 2, the portions of the housing 100 and the organ wafers 300 covered by the cover 200 are indicated by dashed lines. The combination of the housing 100 and the cover 200 can also serve as a packaging structure for packaging the organ wafers 300.

[0012] As shown in Figure 1, the interior of the box 100 has partition walls 130. The number of partition walls 130 can be one or more, for example, two, three, or more. The partition walls 130 divide the interior of the box 100 into multiple spaces 150, such that the multiple spaces 150 are substantially separated from each other by the partition walls 130. In other words, the spaces 150 may be formed by including the box wall 140 portion of the box 100, the partition walls 130, and the bottom 120 of the box 100, but are not limited thereto (described later). In embodiments of the invention, the material of the box 100 may be plastic, and preferably thermoplastic plastics such as, but not limited to, polyethylene terephthalate (PET), polystyrene (PS), polypropylene (PP), high-density polyethylene (HDPE), polyvinyl chloride (PVC), and polylactic acid (PLA). For example, the box 100 and its partition walls 130 may be integrally formed from a sheet of thermoplastic plastic. Furthermore, the material of the box 100 is preferably a transparent or translucent plastic. The cover 200 may be made of plastic, but is not limited to the same material as the box 100. The transparency or light transmittance of the box 100 and the cover 200 facilitates the observation of the organ wafer 300 on the organ wafer system 1.

[0013] The top of the partition wall 130 can further serve as a support surface, for example, for supporting the organ wafer 300. The partition wall 130 may include longitudinal partition walls 1301 and transverse partition walls 1302. The organ wafer 300 may be supported, for example, on a plurality of parallel longitudinal partition walls 1301, or a plurality of transverse partition walls 1302, or on intersecting longitudinal partition walls 1301 and transverse partition walls 1302. The top 136 of the partition wall 130 may also be partially recessed toward the bottom 120 of the housing 100 to form a limiting area for accommodating the organ wafer 300. That is, the partition wall 130 may also form a space 150 away from the bottom 120 inside the housing 100 for accommodating the organ wafer 300. The number of limiting areas or the number of spaces 150 (i.e., the space 150 away from the bottom 120) may correspond to the number of organ wafers 300, but are not limited thereto. For example, when there are two organ chips 300, there can also be two limiting areas, and different organ chips 300 are housed in different limiting areas. The number of limiting areas or spaces 150 can also be different from the number of organ chips 300. For example, a single limiting area, if its volume is sufficient, can accommodate multiple organ chips 300.

[0014] The aforementioned plurality of spaces 150 may further include a plurality of first receiving areas 1501 and at least one second receiving area 1502. The difference lies in that the first receiving area 1501 is located relatively lower inside the box body 100, i.e., closer to the bottom 120 side, while the second receiving area 1502 is located relatively upper inside the box body 100, i.e., closer to the cover 200 side. In a preferred embodiment of the invention, the aforementioned space 150 formed by the box wall 140 portion, the partition wall 130, and the bottom 120 of the box body 100 can serve as the first receiving area 1501, and the limiting area formed on the top 136 of the partition wall 130 can serve as the second receiving area 1502. In an embodiment of the invention, the first receiving area 1501 may further be a receiving groove, and preferably has an appropriate volume and is suitable for containing liquid (described later). The second receiving area 1502 can be used to house the organ wafer 300.

[0015] The volume and / or number of the first accommodating areas 1501 may vary depending on factors such as the size of the housing 100, the arrangement of the partition walls 130, the number of spaces 150, and the organ wafer 300 (described later). For example, as shown in FIG1, three transverse partition walls 1302 and a longitudinal partition wall 1301 at the center of the interior of the housing 100 divide the interior of the housing 100 into multiple first accommodating areas 1501. In the embodiment of FIG1, the number of first accommodating areas 1501 is eight, and their volumes are substantially the same, but the invention is not limited thereto. The number of first accommodating areas 1501 may be more or less, and their volumes may also differ from each other. For example, another housing with the same internal volume as the housing 100 may have four first accommodating areas, and the volume of its first accommodating areas may be larger than that of the first accommodating areas 1501 of the housing 100. In this embodiment of the invention, the volume of the first accommodating region 1501 is typically 5 to 50 ml, for example, 5, 10, 15, 20, 25, 30, 35, 40, 45, or 50 ml, but there is actually no upper limit. The volume of the first accommodating region 1501 can typically be matched with the structure and purpose of the organ wafer 300.

[0016] In several embodiments of the present invention, the shape of the second receiving area 1502 may correspond to that of the organ wafer 300, and its size may substantially match that of the organ wafer 300 to serve as a limiting element. For example, the length of the recessed portion of the middle transverse partition wall 1302 is approximately equal to the transverse length of the organ wafer 300, so that the organ wafer 300 can contact the transverse partition wall 1302 in the transverse direction, avoiding transverse displacement. However, it is understood that the second receiving area 1502 is not limited to being formed by a recess in the top 136 of the partition wall 130.

[0017] Based on research and pharmaceutical development needs, the operation of the organ wafer 300 includes processes such as loading and drug delivery of cells / tissues / organoids, as well as observation of cells / tissues, such as observation of cell morphology and analysis of culture medium. To perform the aforementioned operations, the organ wafer 300 may have, for example, an opening or a similar design. The opening allows communication between the interior and exterior of the organ wafer 300. In this embodiment of the invention, the organ wafer 300 further has a connector 307. Through the connector 307, operations such as drug delivery and culture medium extraction can be performed on the cells / tissues within the organ wafer 300. The connector 307 is also suitable for connecting tubing to perform the aforementioned operations. As shown in FIG1, the cover 200 has a through hole 204, and the through hole 204 can correspond to the connector 307 of the organ wafer 300. Here, "corresponding" may include, for example, the positional correspondence and alignment of the connector 307 and the through hole 204, as well as their operational compatibility. The cover 200 of this embodiment may further have multiple through holes 204, and at least one through hole 204 corresponds to a connector 307. Furthermore, when the organ wafer system 1 has multiple organ wafers 300, at least some of the through holes 204 may correspond to the connectors 307 of different organ wafers 300 respectively. However, it is understood that the cover 200 of this embodiment is not limited to having only through holes 204 for the aforementioned operations. The cover 200 may have different functional designs to accommodate different organ wafers 300.

[0018] As shown in Figure 1, in this embodiment of the invention, the organ wafer 300 further has a plurality of ports 307. The functions or structures of the plurality of ports 307 may be the same or different. For example, the plurality of ports 307 may have different structures and lead to different chambers within the organ wafer 300, but this is not a limitation; or they may be used for drug administration and culture medium extraction, and thus have different uses, but this is not a limitation. The arrangement of the plurality of ports 307 is not limited to that shown in the figure.

[0019] The plurality of connectors 307 may further include a first connector 3071, and the plurality of through holes 204 may further include a first through hole 2041. As shown in FIG2, when the organ wafer 300 is disposed in the second receiving area 1502 of the housing 100 and the cover 200 is disposed on the housing 100, the first through hole 2041 may be aligned and correspond to the first connector 3071. In addition, the first through hole 2041 and the first connector 3071 may also be assembled when the cover 200 is closed on the housing 100. As shown in FIG2, the first through hole 2041 and the first connector 3071 may be further connected to a tube, wherein the tube is adapted to allow fluid to pass through and the fluid can enter and exit the organ wafer 300 through the tube, the first through hole 2041 and the first connector 3071.

[0020] The organ wafer system 1 of this embodiment of the invention preferably further includes a tube 400, which is adapted for the passage of fluid. The "fluid" may include gases such as air and liquids such as culture media. The tube 400 may further include a first tube 410, which can be connected to a first through hole 2041 and a first connection hole 3071. In several embodiments of the invention, for example, the first tube 410 may be directly connected to the first through hole 2041, and when the cover 200 is closed on the housing 100 and the first through hole 2041 is aligned, corresponds, and / or assembled with the first connection hole 3071, the first tube 410 may be further connected to the first connection hole 3071. The connection between the first tube 410 and the first connection hole 3071, and the assembly between the first through hole 2041 and the first connection hole 3071, preferably have airtightness, liquidtightness, or a combination thereof. For example, elastic sealing rings may be provided at the connection and mating points to achieve a tight fit, but this is not a limitation. In addition to the cover 200 covering the box 100, other operations can also be used to assemble the first through hole 2041 and the first connection hole 3071.

[0021] As previously described, the first receiving area 1501 is adapted to contain liquid. The contained liquid may be culture medium from the organ wafer 300, including waste liquid from cells / tissues / organoids. That is, the first receiving area 1501 can be further used to collect culture medium / waste liquid. The liquid collected in the first receiving area 1501 can be subsequently analyzed. For example, biochemical and physiological information of cells / tissues / organoids can be obtained by analyzing the composition of the waste liquid. In a preferred embodiment of the present invention, the organ wafer 300 can be conveyed from the organ wafer 300 to the first receiving area 1501 of the housing 100 through the first tube 410. Because the first receiving area 1501 can be used to receive liquid from the organ wafer 300, its configuration, quantity, and volume can vary depending on the structure of the organ wafer 300, such as its internal structure and purpose.

[0022] As shown in Figures 1 and 2, the plurality of through holes 204 may further include second through holes 2042, and the second through holes 2042 are preferably paired with the first through holes 2041. That is, each first through hole 2041 may be paired with a second through hole 2042. The first tube 410 may be further connected to the second through hole 2042 and guided through the second through hole 2042 to the first receiving area 1501. For example, the first tube 410 may pass through the second through hole 2042 from outside the cover 200 and enter the first receiving area 1501 inside the box 100.

[0023] The arrangement of the second through hole 2042 on the cover 200 can further correspond to the first receiving area 1501. For example, when the cover 200 is closed on the box 100, the projection of the second through hole 2042 on the box 100 can fall into the first receiving area 1501. In this embodiment of the invention, the cover 200 has a plurality of first through holes 2041 and second through holes 2042, and their number can further match the number of first receiving areas 1501. Taking the embodiment shown in Figures 1-2 as an example, when the number of first receiving areas 1501 is eight, the number of first through holes 2041 and second through holes 2042 can also both be eight, wherein the eight second through holes 2042 correspond to the first receiving areas 1501 respectively; however, this is not a limitation. For example, the number of first receiving areas 1501 can also be different from the number of first through holes 2041 and second through holes 2042. In the embodiments shown in Figures 1 and 2, the number of first tubes 410 is also eight, and they can be used to deliver culture medium / waste liquid to eight first receiving areas 1501 respectively, but the present invention is not limited thereto. In some embodiments, the same first receiving area 1501 can receive culture medium / waste liquid from different first tubes 410.

[0024] The plurality of connectors 307 in this embodiment of the invention may further include a second connector 3072, and the plurality of through holes 204 may include a third through hole 2043. When the organ wafer 300 is disposed in the second receiving area 1502 of the housing 100 and the cover 200 is disposed on the housing 100, the third through hole 2043 may be aligned and correspond to the second connector 3072. In addition, the third through hole 2043 and the second connector 3072 may also be assembled when the cover 200 is closed on the housing 100. The third through hole 2043 and the second connector 3072 may also be further connected to the tube 400.

[0025] The tube 400 may further include a second tube 420, which can be connected to the third through hole 2043 and the second connection hole 3072. In several embodiments of the present invention, for example, the second tube 420 may be directly connected to the third through hole 2043, and when the cover 200 is closed on the box 100 and the third through hole 2043 is aligned, corresponds, and / or assembled with the second connection hole 3072, the second tube 420 may be further connected to the second connection hole 3072. The connection between the second tube 420 and the second connection hole 3072 and the assembly between the third through hole 2043 and the second connection hole 3072, as described above, also have airtightness, liquid tightness, or a combination thereof. The second tube 420 may extend from the cover 200 and may be further used to connect components other than the organ wafer system 1. For example, a drug delivery device can be connected to allow the drug to be delivered into the organ chip 300 through the third through-hole 2043 and the second contact 3072; or a gas cylinder can be connected to allow gas to be injected into the organ chip 300.

[0026] The tube 400 of this embodiment is adapted to be connected to a fluid control module, through which fluid flows into and out of the organ chip 300 via the tube 400. For example, the fluid control module 500 can be connected to a drug delivery device to control the output of the drug solution, and / or connected to a gas cylinder to control the output of the gas. The fluid control module 500 can also further push the liquid out of the organ chip 300 through the tube 400, such as tube 410. The outflowing liquid can then flow into the first receiving area 1501 through the tube 400, such as tube 420.

[0027] In several embodiments of the present invention, the organ wafer system 1 may further include a fluid control module 500. Taking the embodiment shown in FIG3 as an example, a second tube 420 extends out of the cover 200 and is connected to the drug delivery device 60, wherein the drug delivery device 60 is connected to the fluid control module 500, and through the fluid control module 500, the drug solution can be delivered from the drug delivery device 60 to the organ wafer 300. The fluid control module 500 may be electrically driven, for example, but the present invention is not limited thereto, that is, it may also be non-electrically driven. For example, the fluid control module 500 may also be mechanically driven.

[0028] The present invention also provides a packaging structure for packaging organ wafers. As shown in FIG4, the packaging structure 10 of the present invention includes a box body 100' and a cover body 200', wherein the organ wafers 300 are housed within the packaging structure 10, and the organ wafers 300 and the packaging structure 10 as a whole are referred to as the organ wafer package 1'. There is no limitation on the number of organ wafers 300 within the packaging structure 10; that is, a single organ wafer 300 can be loaded as shown in FIG4, or multiple organ wafers 300 can be loaded.

[0029] The box body 100' of the packaging structure 10 may be formed of a cushioning material, and the cushioning material may form a support structure 130' inside the box body 100'. In a preferred embodiment of the present invention, the cushioning material includes plastic, thermoplastic plastic, blister formed by plastic molding, or a combination thereof. The box body 100' and its internal support structure 130' may be integrally formed.

[0030] The organ wafer 300 can be supported on the support structure 130'. The support structure 130' may further have a limiting structure for accommodating the organ wafer 300 and restricting its movement. In several embodiments of the present invention, the support structure 130' may have the form of the aforementioned partition wall 130 and include support walls 131. The support walls 131 are equivalent to or similar to the longitudinal partition walls 1301 and transverse partition walls 1302 of the partition walls 130. The organ wafer 300 is further supported on a plurality of support walls 131. For example, the organ wafer 300 is supported on a plurality of parallel longitudinal support walls 1311, or a plurality of transverse support walls 1312, or intersecting longitudinal support walls 1311 and transverse support walls 1312. The support walls 131 may further divide the interior of the housing 100 into a plurality of spaces 150' for containing liquid, just like the partition walls 130. The housing 100' may further have the same structure as the aforementioned housing 100, which will not be described in detail here.

[0031] In addition to packaging the organ wafer 300, the packaging structure 10 can also be used for the operation of the organ wafer 300. As described above, "operation" includes processes such as loading and administering drugs to cells / tissues / organoids, as well as observation of cells / tissues, such as observation of cell morphology and analysis of culture medium. The cover 200' of the packaging structure 10 is further derived to have a structure adapted to the organ wafer 300 and used to assist in operation, such as a through-hole 204' corresponding to the connector 307 of the organ wafer 300. The cover 200' may have the same structure as the aforementioned cover 200, which will not be described again here.

[0032] In summary, the housing 100 and cover 200 of this embodiment can not only be used to operate the organ wafer 300, but also serve as the packaging structure 10 for the organ wafer 300. Since the cover 200 has a structure adapted to the organ wafer 300, including a through-hole 204, and the through-hole 204 can be used to connect and guide the tube 400, and the housing 100 has a first receiving area 1501 that mates with the through-hole 204, the tube 400, and the organ wafer 300, by covering the housing 100 with the cover 200, the connection between the tube 400 and the organ wafer 300 can be achieved, simplifying and standardizing the operation process. Furthermore, the housing 100' and cover 200' of this embodiment can not only be used to package the organ wafer 300, but also for operating the organ wafer 300. After removing the organ wafer 300 from the organ wafer packaging 1' of this embodiment of the invention, the packaging structure 10 can be retained. After cells / tissues / organoids are loaded into the organ wafer 300, subsequent operations can be performed using the packaging structure 10. Since, for example, the step of connecting the tube 400 can be completed by closing the cover 200' and the box 100', the operation process is simplified. Furthermore, since the space 150' inside the box 100' can be used for culture medium / waste liquid collection, the packaging structure 10 can be fully utilized.

[0033] Although the present invention has been disclosed above by way of embodiments, it is not intended to limit the present invention. Those skilled in the art to which this invention pertains may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

[0034] 1: Organ-on-a-chip system 1': Organ chip packaging 10: Packaging Structure 100, 100': Box body 101: Opening 120, 120': Bottom 130: Partition wall 1301: Longitudinal partition wall 1302: Horizontal partition wall 130' : Support structure 131: Supporting wall 1311: Longitudinal support wall 1312: Horizontal support wall 136: Top 140, 140': Box wall 150, 150': space 1501: First Detention Area 1502: Second Storage Area 200, 200': Cover 204, 204': Through holes 2041: First through hole 2042: Second through hole 2043: Third through hole 300: Organ Chips 307: Connector 3071: First connector 3072: Second connector 400: Pipe fittings 410: First fitting 420: Second fitting 500: Fluid Control Module 60: Drug delivery device

Claims

1. An organ-on-a-chip system, comprising: A box having an opening and including at least one partition wall, wherein the interior of the box is divided into multiple spaces by the at least one partition wall; an organ wafer adapted to be disposed inside the box; wherein the organ wafer has at least one connector adapted to connect a tube; a cover corresponding to the opening of the box and adapted to be disposed on the box and cover the interior of the box; wherein the cover has at least one through hole corresponding to the at least one connector of the organ wafer; and at least one tube connected to the at least one connector and the at least one through hole; wherein the at least one tube is adapted to allow fluid to pass through.

2. The organ wafer system as claimed in claim 1, wherein the organ wafer is further supported on the at least one partition wall.

3. The organ wafer system as claimed in claim 2, wherein the housing further includes a plurality of partition walls; the plurality of partition walls include at least one longitudinal partition wall and at least one transverse partition wall, and the at least one longitudinal partition wall and the at least one transverse partition wall are interleaved; wherein the organ wafer is carried on the at least one longitudinal partition wall and the at least one transverse partition wall.

4. The organ wafer system as claimed in claim 1, wherein the plurality of spaces further includes a plurality of first receiving areas and at least one second receiving area; the at least one second receiving area is located above the plurality of first receiving areas on the side of the housing closer to the cover, and the organ wafer is further disposed in the at least one second receiving area.

5. The organ wafer system as claimed in claim 4, wherein the top of the at least one partition wall is further partially recessed to form the at least one second receiving area.

6. The organ wafer system as claimed in claim 4, wherein the plurality of first receiving areas are a plurality of receiving slots, and each receiving slot is surrounded by a box wall portion of the housing, the at least one partition wall, or a combination thereof.

7. The organ wafer system as claimed in claim 4, wherein the plurality of vias includes at least one first via and at least one second via, and the at least one first via and the at least one second via are arranged in pairs and are equal in number.

8. The organ wafer system as claimed in claim 7, wherein the at least one tube includes at least one first tube, and the at least one connector includes at least one first connector, and the at least one first tube is connected to the at least one first connector, the at least one first through hole and the at least one second through hole and is connected via the at least one second through hole to at least one of the plurality of first receiving areas.

9. The organ wafer system as claimed in claim 8, wherein the at least one tube further includes at least one second tube, the at least one port further includes at least one second port, and the plurality of through holes further includes at least one third through hole, and the at least one second tube is connected to the at least one second port and the at least one third through hole and extends out of the cover body.

10. The organ wafer system as claimed in claim 9, wherein when the cover is disposed on the housing, the at least one first through hole is aligned with the at least one first connector hole, and the at least one third through hole is aligned with the at least one second connector hole.

11. The organ wafer system as claimed in claim 1, wherein the at least one tube is further adapted to be connected to a fluid control module for fluid passage.

12. An organ-on-a-chip package, comprising: A packaging structure includes: a box body formed of a cushioning material and having an opening, wherein the cushioning material forms a support structure inside the box body; a cover corresponding to the opening of the box body and disposed on the box body and covering the interior of the box body; and an organ wafer housed within the packaging structure, wherein the organ wafer is supported on the support structure.

13. The organ wafer packaging as described in claim 12, wherein the cushioning material is a thermoplastic.

14. The organ wafer packaging as described in claim 13, wherein the housing and its supporting structure are further integrally formed from a sheet of the thermoplastic.

15. The organ wafer package as claimed in claim 12, wherein the support structure includes at least one support wall, and the organ wafer is further supported on the at least one support wall.

16. The organ wafer package as claimed in claim 15, wherein the support structure further includes a plurality of support walls; the plurality of support walls include at least one longitudinal support wall and at least one transverse support wall, and the at least one longitudinal support wall and the at least one transverse support wall are interleaved; wherein the organ wafer is supported on the at least one longitudinal support wall and the at least one transverse support wall.

17. The organ wafer package as claimed in claim 16, wherein the at least one longitudinal support wall and the at least one transverse support wall further divide the interior of the package into multiple spaces.

18. The organ wafer package as claimed in claim 12, wherein the organ wafer further has at least one connector adapted for connecting a tube, and the cover further has at least one through hole corresponding to the at least one connector of the organ wafer and adapted for the passage of a tube.

19. The organ wafer packaging as described in claim 12, wherein the packaging structure is made of plastic, thermoplastic, blister pack, or a combination thereof.

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