Copper or copper alloy conductor wire and manufacturing method thereof

Abstract

A copper or copper alloy conductor wire, wherein the conductor wire is made of copper or copper alloy, and in an X-ray diffraction pattern when X-rays are irradiated from a direction perpendicular to the length direction of the conductor wire, the peak intensity of the copper

Description

Technical Field

[0001] This invention relates to a copper or copper alloy wire and a method for manufacturing the same. Prior Technology

[0002] In the past, various types of wires were used in electronic devices. In recent years, with the miniaturization of electronic devices, there has been a greater demand for high-density mounting of the various circuit boards used within them. Thus, various types of wires are used in a wide variety of circuit boards, including mounting substrates and IC packaging substrates. The wires used in these circuit boards have requirements for processability and rigidity.

[0003] Patent Document 1 describes a copper alloy wire used in the coil of a miniature loudspeaker, etc. The copper alloy wire described in Patent Document 1 is manufactured by first drawing a copper alloy ingot, which is then cast from molten metal, into a wire. Next, the resulting wire is heat-treated to produce the copper alloy wire.

[0004] Patent Document 2 discloses a wire for an inspection device. The wire for the inspection device disclosed in Patent Document 2 is manufactured by drawing a copper alloy wire of a predetermined thickness and then subjecting it to tension annealing heat treatment.

[0005] (Patent Documents)

[0006] (Patent Document 1) International Publication No. 2018 / 100919.

[0007] (Patent Document 2) Japanese Patent Application Publication No. 2019-143981. Summary of the Invention

[0008] (Problem to be solved by the invention) With the miniaturization of electronic devices, the diameter of wires is also continuously decreasing. When wires are made smaller, their machinability tends to decrease. For example, in the case of manufacturing contact probes, the decrease in elongation associated with diameter reduction is considered to easily cause wire breakage and reduce machinability.

[0009] The main objective of this invention is to provide a copper or copper alloy wire that maintains Vickers hardness and has good machinability even when the wire diameter is reduced, and a method for manufacturing the same.

[0010] (Means for solving the problem) The present invention provides a copper or copper alloy wire, wherein the wire is made of copper or copper alloy, and in the X-ray diffraction pattern of X-ray diffraction when X-rays are irradiated from a direction perpendicular to a length direction of the wire, the ratio of the peak intensity of a copper (111) surface to the sum of the peak intensity of the copper (111) surface and the peak intensity of a copper (220) surface is 50% or more.

[0011] To address the aforementioned issues, one embodiment of the present invention provides a method for manufacturing a copper or copper alloy wire, comprising: a procedure for preparing a wire made of copper or copper alloy; and a procedure for twisting the wire using a mold to obtain the copper or copper alloy wire; wherein, in the diffraction pattern of X-ray diffraction when X-rays are irradiated from a direction perpendicular to a length direction of the wire, the peak intensity of a copper (111) surface is 50% or more relative to the sum of the peak intensity of the copper (111) surface and the peak intensity of a copper (220) surface.

[0012] (Effects of the Invention) The present invention provides a copper or copper alloy wire that maintains Vickers hardness and has good machinability even when the diameter is reduced. Simple Explanation of the Diagram

[0013] Figure 1 is a schematic diagram illustrating the method of X-ray diffraction. Figure 2 is a flowchart illustrating a method for manufacturing a wire according to an embodiment of the present invention. Figure 3 is a schematic diagram showing the structure of a processing device with a mold for performing a torsion processing procedure. Figure 4 is a schematic diagram showing the structure of a machining device with a cutting tool for performing a torsional machining process. Implementation

[0014] The following describes a conductor (referred to in the claims as "copper or copper alloy conductor") and a method for manufacturing the conductor, according to an embodiment of the present invention. The conductor and the method for manufacturing the conductor are not limited to the embodiments shown below. In this specification, "to" indicating a numerical range includes both the upper and lower limits of the range.

[0015] (Wire Structure) The wire (copper or copper alloy wire) in this embodiment is made of copper or a copper alloy. "Made of copper" means that it may contain unavoidable impurities. The copper content of the copper wire can be appropriately selected to match the desired properties of the wire, but 99.9 wt% or more is preferred.

[0016] Examples of unavoidable impurities include iron, tin, beryllium, zinc, nickel, magnesium, aluminum, titanium, zirconium, indium, silicon, and phosphorus. It is preferable for copper wires to contain less than 0.1 wt%, and more preferably less than 0.01 wt%. When the unavoidable impurity content exceeds 0.1 wt%, tensile strength and other properties may decrease.

[0017] "Made of copper alloy" implies the potential presence of unavoidable impurities. In this embodiment, the copper alloy includes copper and other metals, and may also contain unavoidable impurities. The copper content in the conductor made of copper alloy can be appropriately selected to suit the desired properties of the conductor, but is preferably in the range of 70.0 to 99.9 wt%, and more preferably in the range of 76.0 to 99.7 wt%. When the copper content is within this range, the ductile elongation of the conductor is more likely to be within the desired range. Examples of other metals include silver, tin, titanium, magnesium, aluminum, silicon, phosphorus, chromium, iron, manganese, cobalt, nickel, zinc, zirconium, niobium, and indium. The content of other metals in the conductor made of copper alloy is preferably in the range of 0.1 to 30.0 wt%, and more preferably in the range of 0.3 to 24.0 wt%. Examples of unavoidable impurities and their contents are as described above.

[0018] The diameter of the conductor can be appropriately selected according to its application, but a range of 0.01 to 0.60 mm is preferred. It should be noted that when the conductor's cross-sectional shape is not circular, the conductor's diameter refers to the diameter of its circumcircle. When the conductor's diameter is within this range (e.g., in applications such as electrical characteristic testing devices or probes), the conductors can be arranged with narrow spacing.

[0019] In the X-ray diffraction pattern obtained when X-rays are irradiated from a direction perpendicular to the length of the conductor, the ratio of the peak intensity of the (111) plane of copper to the sum of the peak intensities of the (111) plane and the (220) plane of copper is 50% or more, preferably 55.0% or more, and more preferably 70% or more. Furthermore, the ratio of the peak intensity of the (111) plane of copper is preferably 95% or less, and more preferably 90% or less. Thus, having a peak intensity ratio of 50% or more for the (111) plane of copper means that the crystallization orientation of the copper crystals is aligned in a predetermined direction. This improves the elongation (plastic elongation) of the conductor described later. It should be noted that the method for increasing the peak intensity ratio of the (111) plane of copper to 50% or more includes the torsion processing described later.

[0020] In the X-ray diffraction pattern obtained when X-rays are irradiated from a direction perpendicular to the length of the conductor, the ratio of the peak intensity of the copper (220) surface to the sum of the peak intensities of the copper (111) surface and the copper (220) surface is preferably less than 50%, less than 45.0%, and more preferably less than 30%. Furthermore, the ratio of the peak intensity of the copper (220) surface is preferably 10% or more, and more preferably 5% or more. It should be noted that, in order to ensure that the ratio of the peak intensity of the copper (220) surface is less than 50%, the torsion process described later is preferable.

[0021] In the X-ray diffraction pattern obtained by irradiating X-rays from a direction perpendicular to the length of the conductor, the ratio of the peak intensity of the (111) plane of copper to the sum of the peak intensities of the (111) plane and the (220) plane of copper before and after the twisting process is significantly different from the ratio of the peak intensity of the (220) plane of copper. The wire before the twisting process can be drawn or rolled to obtain the desired size, while improving tensile strength and hardness. However, it is known that this is accompanied by the copper as the base material having a specific crystal orientation and a clustered structure. Specifically, when the wire is reduced to the desired diameter by drawing or other processes, the ratio of the peak intensity of the (111) plane of copper becomes smaller than the ratio of the peak intensity of the (220) plane of copper in the X-ray diffraction pattern obtained by irradiating X-rays from a direction perpendicular to the length of the conductor. On the other hand, in the conductor after twisting, the proportion of peak intensity of the copper (111) plane can be greater than the proportion of peak intensity of the copper (220) plane. Thus, it can be considered that by performing twisting, the density of the aggregate structure in the conductor is reversed compared with that before the process, resulting in better plastic elongation as described later.

[0022] Here, the ratio of the peak intensity of the (110) plane of copper and the ratio of the peak intensity of the (220) plane of copper can be determined in the following way. Figure 1 is a schematic diagram illustrating the method of X-ray diffraction. First, as shown in Figure 1, X-rays are irradiated from a direction perpendicular to the length direction of the conductor 130 using a concentrated beam method using an X-ray rotating cathode generator (Ag wire source) 100, and the diffraction peaks are detected by passing through an X-ray detector 120 using the 2θ-θ method. In order to obtain the average diffraction peaks of the entire conductor 130, it is preferable to rotate the conductor 130. Next, the phases of the diffraction peaks are identified, and the intensities (heights) of the (111) plane and the (220) plane of copper are calculated respectively. Next, the ratios of the peak intensities of the (111) plane and the (220) plane of copper to the sum of the peak intensities of the (110) plane and the (220) plane of copper are calculated. That is, the ratio of the peak intensity of the (111) plane to the peak intensity of the (220) plane of copper when the sum of the peak intensities of the (111) plane and the (220) plane of copper is 100. X-ray diffraction is performed using the 2θ-θ method, for example, by using a 50 mm long test wire, with the test wire being rotated while measuring. However, the size of the test wire is not limited to the shape described above; the size of the test wire only needs to be suitable for placement in the X-ray diffraction apparatus.

[0023] There is no particular limitation on the wire spacing during the torsion process of the conductor, but 2.0 mm or less is preferred. Here, "wire spacing" refers to the distance that the unavoidable shallow scratches that occur in the parallel length direction during the wire drawing process described later travel in the long side direction during one revolution of the torsion-processed wire. If the wire spacing is 2.0 mm or less, it will be within the desired diffraction peak strength range and the plastic elongation will be improved.

[0024] In this embodiment, the Vickers hardness of the conductor cross-section is in the range of 100 to 350 HV. Here, "cross-section" means a cross-section perpendicular to the length direction of the conductor. When the Vickers hardness is within the above range, it is easier to use as a probe, etc. Furthermore, the ratio of the Vickers hardness at the center of the conductor cross-section to the Vickers hardness at the periphery is in the range of 0.90 to 1.10. Here, "cross-section" means a cross-section perpendicular to the length direction of the conductor. "Center" refers to the area near the center of the conductor, for example, the area on the center side when the radius of the conductor is divided into two parts from the center. Furthermore, the center is the centroid of the conductor cross-section. In addition, "periphery" means the area near the circumference of the conductor, for example, the area from the outer circumference of the conductor to a depth of half the radius of the conductor. In addition, when the Vickers hardness is within the above range, if the conductor tip shape is flat, wear is uniform, and if the conductor tip shape is needle-shaped, the tip will not easily become blunt. The Vickers hardness in this specification is the value measured according to JIS Z 2244-1 2020. In addition, hardness can also be measured using the nanoindentation method. It is known that there is a relationship between nanoindentation hardness and Vickers hardness, which is a general indicator of hardness, for example, Vickers hardness = (76.2 × nanoindentation hardness) + 6.3 (Non-Patent Literature 1: Metals, Vol. 78 (2008) No. 9, p. 47).

[0025] The elongation (plastic elongation) of the conductor is preferably between 1.0% and 3.0%. This elongation can be determined using a precision universal testing machine (e.g., manufactured by Shimadzu Corporation). If the elongation (plastic elongation) of the conductor is 1.0% or higher, it can suppress wire breakage or cracking during subsequent drawing, stamping, bending, and other processes. Furthermore, when the elongation (plastic elongation) of the conductor exceeds 3.0%, sagging is more likely to occur during processes such as cutting the conductor. Plastic elongation can be measured by dividing the strain at fracture in a tensile test by the strain at 0.2% of the yield strength. The resulting value is taken as the elongation (plastic elongation) of the conductor.

[0026] (Method for manufacturing the conductor) Next, the method for manufacturing the conductor will be described. Figure 2 is a flowchart of the method for manufacturing the conductor according to an embodiment of the present invention.

[0027] As shown in Figure 2, the manufacturing method includes a process for preparing a wire made of copper or copper alloy (S110) (hereinafter referred to as the "preparation process") and a process for twisting the wire (S120) (hereinafter referred to as the "twisting process").

[0028] In the preparation procedure (S110), a wire made of copper or a copper alloy is prepared. The composition of the wire is the same as that of the copper or copper alloy described above. The wire can be, for example, a wire manufactured by any method, or a wire made of any casting diameter that is rolled by drawing or rolling, or a wire processed by a combination of drawing and rolling. The diameter of the prepared wire is preferably in the range of 0.01 to 0.60 mm.

[0029] In the twisting process (S120), the wire prepared in the preparation process is twisted. The structure of the processing apparatus used for the twisting process is not particularly limited. Figure 3 is a schematic diagram showing an example of the structure of the processing apparatus 200 for performing the twisting process.

[0030] As shown in Figure 3, in the processing apparatus 200, a mold 230 is provided between one spool 210 and the other spool 220. The mold 230 is used to process the diameter of the wire to a cross-sectional reduction rate of 0.5% to 25.0%. One spool 210 rotates at a certain speed along the circumference of the wire 140 while winding the wire 140 onto the other spool 220 to transport the wire 140. The rotational speed of the spool 210 is preferably within a range of 2.0 mm or less relative to the transport speed. If the cross-sectional reduction rate of the mold aperture is less than 0.5%, the torsion cannot be effectively applied to the wire; if it is greater than 25.0%, the risk of wire breakage increases. Furthermore, the mold can be rotated as needed to adjust the straightness of the conductor.

[0031] By twisting the conductor, in the X-ray diffraction pattern of the conductor, the ratio of the peak intensity of the (111) plane of copper to the sum of the peak intensity of the (111) plane of copper and the peak intensity of the (220) plane of copper reaches more than 50%, and the plastic elongation becomes good.

[0032] (Effect) As shown above, in the conductor of this embodiment, as shown in FIG1, in the X-ray diffraction pattern when X-rays are irradiated from a direction perpendicular to the length direction of the conductor, the ratio of the peak intensity of the (111) surface of copper to the sum of the peak intensity of the (111) surface of copper and the peak intensity of the (220) surface of copper is more than 50%. Since the crystallization orientation of copper is aligned with the predetermined direction, it has excellent plastic elongation.

[0033] (Examples) Hereinafter, the present invention will be described in more detail by way of examples. However, the scope of the present invention is not limited in any way by these examples, and the examples may be modified without departing from the spirit of the present invention.

[0034] 1. Manufacturing of wires

[0035] (1) Manufacturing of wire 1. The raw material is heated to 1000 to 1400°C to melt it, and a melt (molten metal) containing 10 wt% Ag and the remainder being Cu and unavoidable impurities is prepared. The melt (molten metal) is poured into a mold and cooled to room temperature within 10 minutes to cast a rod with a diameter of 12 mm. The cast rod is then heated at 500°C for 10 hours in an atmosphere of N2 gas. After that, the heated rod is drawn from a diameter of 12 mm to a diameter of 2.0 mm to manufacture a wire. The resulting wire is then heated again at 350°C for 30 hours in an atmosphere of N2 gas. After that, the reheated 2.0 mm diameter wire is drawn to a diameter of 0.05 mm to manufacture wire 1.

[0036] (2) Manufacturing of wire 2. Using the processing device shown in Figure 3, which is equipped with a mold with a hole diameter of 0.048 mm, the wire spacing of wire 1 is twisted to 0.5 mm to manufacture wire 2.

[0037] (3) Manufacturing of wire 3. Using the processing device shown in Figure 3, which is equipped with a mold with a hole diameter of 0.048 mm, the wire spacing of wire 1 is twisted to 1.5 mm to manufacture wire 3.

[0038] (4) Manufacturing of wire 4. Wire 1 is twisted using a machining device with cutting tools, as shown in Figure 4, without the use of molds, to manufacture wire 4. Figure 4 shows the structure of the machining device with cutting tools. As shown in Figure 4, the machining device 300 has a pair of rotating plates (a first rotating plate 311a and a second rotating plate 311b) that clamp the wire 140 in the middle and are arranged facing each other. The pair of rotating plates (the first rotating plate 311a and the second rotating plate 311b) are connected to a motor (not shown) and are integrally rotated at a certain speed along the circumference of the wire 140 with the wire 140 as the central axis. The first rotating plate 311a has a first support portion 312a and a third support portion 312c for supporting the wire 140 at a predetermined height. The second rotating plate 311b has a second support portion 312b for pushing the wire 140 into a predetermined position. Each of the support portions 312a, 312b, and 312c has a groove (not shown) at its end for supporting the conductor 140.

[0039] First, the wire 140 is supported by the first support portion 312a, the second support portion 312b, and the third support portion 312c of the processing device 300. At this time, the height or position of the first support portion 312a, the second support portion 312b, and the third support portion 312c is adjusted so that the angle (α and β in Figure 4) between the wire 140 pressed by the second support portion 312b and the conveying direction is between 10° and 70°. Angles α and β formed by the wire 140 and the conveying direction are preferably between 20° and 50°, and more preferably between 20° and 40°. The angles α and β can also be different values, but the same value is preferred. Next, while conveying the wire 140 from one spool 350 side to the other spool 360 side at a certain speed, the rotating plates of the processing device 300 (the first rotating plate 311a and the second rotating plate 311b) rotate at a certain speed along the circumference of the wire 140. In the torsion machining process, as shown below, the torsion machining is performed with a torsion machining amount of 20 revolutions / mm.

[0040] Torsional processing amount = rotational speed (rpm) / conveyor speed (mm / min).

[0041] (5) Manufacturing of conductor 5. Conductor 5 is manufactured in the same manner as conductor 1, except that a copper alloy containing 3.0 wt% silver is used.

[0042] (6) Manufacturing of wire 6. Using the processing device shown in Figure 3, which is equipped with a mold with a hole diameter of 0.048 mm, the wire spacing of wire 5 is twisted to 0.5 mm to manufacture wire 6.

[0043] (7) Manufacturing of conductor 7. Conductor 7 is manufactured in the same manner as conductor 1, except that a copper alloy containing 24.0 wt% silver is used.

[0044] (8) Manufacturing of wire 8. Using the processing device shown in Figure 3, which is equipped with a mold with a hole diameter of 0.048 mm, the wire spacing of wire 7 is twisted to 0.5 mm to manufacture wire 8.

[0045] (9) Manufacturing of conductor 9. Prepare a copper alloy wire containing 0.3 wt% tin. Then, manufacture conductor 9 by wire drawing.

[0046] (10) Manufacturing of wire 10. Using the processing apparatus shown in FIG3, which is equipped with a mold with a hole diameter of 0.048 mm, the wire spacing of wire 8 is twisted to 0.5 mm to manufacture wire 10.

[0047] (11) Manufacturing of wire 11. The raw material is heated to 1300 to 1500°C in a high-frequency melting furnace to melt it, and a melt containing 3.2 wt% Ti and the remainder being Cu and unavoidable impurities is prepared (molten metal), which is then melted into a cylindrical shape with a diameter of 15 mm. The melted material is homogenized at 900°C for one hour and then rapidly cooled, and processed by hot-groove roller processing or cold-groove roller processing to obtain a rod with a diameter of 3 mm. Next, the 3 mm rod is solution-treated at 900°C for 10 minutes and then rapidly cooled, followed by multi-stage over-aging treatment at 600°C for 3 hours, 550°C for 3 hours, 500°C for 3 hours, and 450°C for 12 hours. Finally, the rod is drawn into a wire with a diameter of 0.1 mm to manufacture wire 11.

[0048] (12) Manufacturing of wire 12. Using the processing apparatus shown in Figure 3, which is equipped with a mold with a hole diameter of 0.094 mm, the wire spacing of wire 11 is twisted to 1.0 mm to manufacture wire 12.

[0049] (13) Manufacturing of conductor 13. Prepare copper wire. Next, manufacture conductor 13 by wire drawing.

[0050] (14) Manufacturing of wire 14. Using the processing apparatus shown in FIG3, which is equipped with a mold with a hole diameter of 0.048 mm, the wire spacing of wire 13 is twisted to 0.5 mm to manufacture wire 14.

[0051] The metallic composition of each conductor and the manufacturing conditions of the conductor are shown in Table 1.

[0052] distinguish wire No. Metal composition (wt%) Wire drawing processing Torsion processing method Guy wire spacing (mm) Torsional spacing (rpm) Comparative example 1 Cu-10Ag + - - - Example 2 Cu-10Ag + mold 0.5 - Example 3 Cu-10Ag + mold 1.5 - Comparative example 4 Cu-10Ag + knives - 20 Comparative example 5 Cu-3Ag + - - - Example 6 Cu-3Ag + mold 0.5 - Example 7 Cu-24Ag + - - - Comparative example 8 Cu-24Ag + mold 0.5 - Example 9 Cu-0.3Sn + - - - Example 10 Cu-0.3Sn + mold 0.5 - Comparative example 11 Cu-3.2Ti + - - - Example 12 Cu-3.2Ti + mold 1.0 - Comparative example 13 Cu + - - - Example 14 Cu + mold 0.5 - Table 1

[0053] 2. Various measurements

[0054] (1) Measurement of Vickers hardness. Vickers hardness is measured in accordance with JIS Z 2244-1 2020.

[0055] (2) Measurement of plastic elongation. Elongation is measured using a precision universal testing machine. Specifically, the strain at fracture during the tensile test is divided by the strain at 0.2% of the yield strength. The resulting value is taken as the elongation (plastic elongation) of the conductor. Plastic elongation is evaluated using the following criteria. A ○ indicates a plastic elongation of 1.0% or more, and × indicates a plastic elongation of less than 1.0%.

[0056] (3) Measurement of peak intensity ratio. Peak intensity was measured by first irradiating X-rays from a direction perpendicular to the length of the conductor using the concentrated beam method, and then detecting the diffraction peaks using the 2θ-θ method. Next, the phases of the diffraction peaks were identified, and the intensity (height) of the copper (111) and copper (220) surfaces was calculated. Then, the ratio of the peak intensity of the copper (110) surface to the sum of the peak intensities of the copper (111) and copper (220) surfaces was calculated.

[0057] The metal composition of the conductor, the diameter of the conductor, and the measurement results are shown in Table 2.

[0058] distinguish wire No. composition (wt%) diameter (mm) Vickers hardness (HV) Plastic elongation (%) Young's modulus (MPa) Peak intensity ratio (111) Surface ratio (220) Surface ratio Comparative example 1 Cu-10Ag 0.050 288 0.8 (×) 117800 33 67 Example 2 Cu-10Ag 0.048 327 1.3 (○) 107700 90 10 Example 3 Cu-10Ag 0.048 318 1.0 (○) 108300 56 44 Comparative example 4 Cu-10Ag 0.050 333 0.4 (×) 120900 32 68 Comparative example 5 Cu-3Ag 0.050 239 0.3 (×) 129800 37 63 Example 6 Cu-3Ag 0.048 255 1.1 (○) 121760 81 19 Comparative example 7 Cu-24Ag 0.050 326 0.8 (×) 110484 46 54 Example 8 Cu-24Ag 0.048 360 1.2 (○) 106740 65 35 Comparative example 9 Cu-0.3Sn 0.050 155 0.6 (×) 142700 45 55 Example 10 Cu-0.3Sn 0.048 156 1.3 (○) 135100 80 20 Comparative example 11 Cu-3.2Ti 0.100 333 0.4 (×) 121400 48 52 Example 12 Cu-3.2Ti 0.092 347 1.3 (○) 116400 72 28 Comparative example 13 Cu 0.050 103 0.6 (×) 119700 38 62 Example 14 Cu 0.048 104 1.6 (○) 110133 74 26 Table 2

[0059] As shown in Tables 1 and 2, in the diffraction diagrams of X-ray diffraction when X-rays are irradiated from a direction perpendicular to the length of the conductor, conductors 2, 3, 6, 8, 10, 12, and 14, whose peak intensity of the copper (111) surface is more than 50% relative to the sum of the peak intensity of the copper (111) surface and the peak intensity of the copper (220) surface, have the same Vickers hardness as the comparative examples 1, 4, 5, 7, 9, 11, and 13 that have not undergone torsion processing. That is, while maintaining Vickers hardness, they also have good plastic elongation.

[0060] On the other hand, conductors 1, 4, 5, 7, 9, 11, and 13, whose peak intensity ratio on the (111) surface of the copper is less than 50%, have poor plastic elongation. This is believed to be due to the lack of use of a mold for torsion processing.

[0061] (Industrial applicability) The wires (copper or copper alloy wires) of the present invention can be used, for example, as probes, suspension wires, medical wires, etc.

[0062] (100): X-ray rotating cathode generator (Ag beam source) (120): Detector (130): Wire (140): Wire (200)(300): Processing device (210)(220)(350)(360): Bollard (230): Mold (311a): First rotating plate (311b): Second rotating plate (312a): First support section (312b): Second support section (312c): Third support section

Claims

1. A copper or copper alloy wire, wherein, The conductor is made of copper or a copper alloy. In the diffraction pattern of X-ray diffraction when X-rays are irradiated from a direction perpendicular to the length direction of the conductor, the ratio of the peak intensity of the (111) surface of the copper to the sum of the peak intensity of the (111) surface of the copper and the peak intensity of the (220) surface of the copper is 50% or more; wherein the wire spacing of the twisting process of the conductor is 2.0 mm or less.

2. The copper or copper alloy wire as described in claim 1, wherein, The wire is made of this copper alloy.

3. The copper or copper alloy wire as described in claim 2, wherein, The copper content in this copper alloy ranges from 70.0 to 99.9 wt%.

4. A method for manufacturing a copper or copper alloy wire, comprising: The procedure for preparing a wire made of copper or a copper alloy; The procedure for obtaining the copper or copper alloy wire by twisting the wire with a mold; wherein, in the diffraction pattern of X-ray diffraction when X-rays are irradiated from a direction perpendicular to a length direction of the wire, the peak intensity of the (111) surface of a copper wire is 50% or more relative to the sum of the peak intensity of the (111) surface of the copper wire and the peak intensity of the (220) surface of the copper wire.

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