Copper alloys and electronic components

TW202639875APending Publication Date: 2026-10-01JX NIPPON MINING & METALS CORP
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Patent Information

Application Number
TW115103991
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-05
Filing Date
2026-02-02
Publication Date
2026-10-01

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Abstract

The present invention is a copper alloy containing 1.5% to 5.0% by mass of Ti, with the remainder consisting of Cu and unavoidable impurities. The ratio of the full width at half maximum (FWHM) β(220) of the peak of the (220) plane obtained by X-ray diffraction measurement of the surface of the copper alloy to the FWHM β0(220) of the peak of the (220) plane obtained by X-ray diffraction measurement of pure copper standard powder (β(220) / β0(220)) is greater than 0 and less than 3.30. none
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