Directional deposition of inhibiting layer for area selective deposition
TW202639907APending Publication Date: 2026-10-01APPLIED MATERIALS INC
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Patent Information
- Application Number
- TW114147275
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-04
- Filing Date
- 2025-12-03
- Publication Date
- 2026-10-01
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Figure TWG2TA001078646_001 
Figure TWG2TA001078646_002 
Figure TWG2TA001078646_003
Abstract
The patterned structure includes a top surface and at least one opening having at least one sidewall surface and a bottom surface, to form the inhibiting layer on the top surface and the bottom surface. A metal layer may then be selectively formed on the sidewall surface of the patterned structure.
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