Surface-treated copper foil and copper-clad laminate
TW202639947APending Publication Date: 2026-10-01JX NIPPON MINING & METALS CORP
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Patent Information
- Application Number
- TW115105444
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-27
- Filing Date
- 2026-02-11
- Publication Date
- 2026-10-01
Abstract
The surface-treated copper foil of the present invention comprises a copper foil and a chromate layer disposed on at least one side of the copper foil. The chromate layer comprises at least one element selected from the group consisting of P, S, and N, Ag, and Cr. When the surface of the chromate layer is measured by XPS, the ratio of the total atomic ratio of Ag and Cr to the total atomic ratio of Ag, Cr, P, S, and N (AgCr) is 0.400 to 0.999. none
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