Substrate manufacturing method

TW202639951APending Publication Date: 2026-10-01KAO CORP
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Patent Information

Application Number
TW115102878
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2026-01-22
Filing Date
2026-01-23
Publication Date
2026-10-01
Patent Text Reader

Abstract

In one embodiment, the present invention provides a method for manufacturing a substrate that can suppress the generation of water-insoluble substances and suppress residues adhering to the substrate. In one embodiment, the present invention relates to a method for manufacturing a substrate, comprising the following steps 1 and 2, performed sequentially. Step 1: Etching the etched layer of a substrate having an etched layer containing a group 6 element metal using a composition comprising phosphoric acid, nitric acid, and an organic acid. Step 2: Cleaning the substrate obtained in step 1 with an acid having a pKa of 4 or less.
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