Electroplating solution and preparation method thereof and forming metal coating film

TW202639959APending Publication Date: 2026-10-01MING CHI UNIVERSITY OF TECHNOLOGY
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Patent Information

Application Number
TW114110570
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-03-20
Publication Date
2026-10-01

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Abstract

An electroplating solution is applied for an electroplating process. The electroplating solution includes a deep eutectic solution, tantalum tetrachloride, inorganic acid ammonium fluoride, sodium citrate, yttrium chloride and EM bacterial solution. The deep eutectic solution is a mixture of chloride choline and urea in a mole ratio of
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