Surface-treated copper foil and copper-clad laminate
TW202639960APending Publication Date: 2026-10-01JX NIPPON MINING & METALS CORP
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Patent Information
- Application Number
- TW115105446
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-27
- Filing Date
- 2026-02-11
- Publication Date
- 2026-10-01
Abstract
A surface-treated copper foil comprises a copper foil and a surface treatment layer disposed on at least one surface of the copper foil. The surface treatment layer contains Zn, and the amount of Zn adsorbed in the surface treatment layer is 300 to 1000 μg / dm². Furthermore, the semi-softening temperature of the surface-treated copper foil is below 145°C. none
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