Surface-treated copper foil, copper-clad laminates and printed wiring boards

Abstract

The surface-treated copper foil of the present invention comprises a copper foil and a surface-treated layer disposed on at least one side of the copper foil. The surface-treated layer comprises Cr and one or more elements selected from Ni, W, Co, Fe, and Mo. When the surface of the surface-treated layer is measured by XPS, the ratio of the atomic ratio of Cr to the total atomic ratio of Cr, Zn, P, S, N, Ni, W, Co, Fe, and Mo is 30.0% or more. When the surface-treated layer is measured by XPS depth analysis, at the Cr peak position closest to the surface of the surface-treated layer, the ratio of the intensity of Zn to the intensity of Cr is 150% or less, and at a position 0.9 nm or more from the Cr peak position closest to the surface of the surface-treated layer (converted to SiO2), there is a maximum value of the intensity of an element that satisfies the following conditions (A) and (B). (A) There is a maximum value of the intensity of one or more elements selected from Ni, W, Co, Fe, and Mo. (B) The ratio of the maximum intensity of the element to the intensity of Cr at the Cr peak position closest to the surface of the surface treatment layer is 35.0% or more. none

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