Shielding devices and electroplating shielding methods

Abstract

This invention proposes a shielding device and an electroplating shielding method, comprising a shielding plate with a central opening at its center, the central opening being a regular polygon; and at least one baffle plate movably disposed radially within the shielding plate, wherein each baffle plate corresponds to one side of the regular polygon. The shielding device and electroplating shielding method of this invention, by providing at least one radially movable baffle plate within the shielding plate, allows for adjustment of the shielding area by adjusting the position of the baffle plate, thereby meeting the edge shielding requirements of different wafer electroplating processes and improving the versatility and flexibility of the shielding device.

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