Substrate electroplating equipment

Abstract

This application provides a substrate electroplating apparatus, comprising: an electroplating chamber for containing an electroplating solution; a substrate holding device for holding a substrate, the substrate holding device including a cup-shaped chuck and a driving assembly, the cup-shaped chuck including a contact ring and a support portion, the support portion for supporting the substrate when the substrate holding device holds the substrate; the contact ring including a plurality of conductive pins for conducting electricity to the substrate during electroplating, with a first gap between adjacent conductive pins; the driving assembly including a rotary drive for driving the cup-shaped chuck to rotate; and a nozzle assembly including a first nozzle configured to blow dry gas from above the conductive pins toward the conductive pins while the cup-shaped chuck rotates, and to allow a portion of the dry gas to enter below the conductive pins through the first gap, blowing the upper surface of the support portion.

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