Panel metal deposition and thinning equipment

Abstract

This application proposes a panel metal deposition and thinning equipment, comprising: a panel loading port, a front-end module, and a processing module. The processing module includes multiple process chambers, including a pre-wetting chamber, an electroplating chamber, a cleaning chamber, and an electropolishing chamber; wherein the number of electropolishing chambers is greater than the number of electroplating chambers. This application integrates electroplating and electrochemical polishing processes into a single device. Electrochemical polishing is used after the electroplating and cleaning processes to thin the metal layer on the panel surface, reducing panel stress. In the subsequent chemical mechanical polishing (CMP) process, the thickness of the metal layer to be removed from the panel surface is reduced, shortening the CMP process time, reducing the consumption of process chemicals and consumables, lowering process costs, and increasing the production capacity of the CMP equipment.

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