Maintenance methods for jigs, plating equipment, and power supply pins.
TW202639971APending Publication Date: 2026-10-01EBARA CORP
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Patent Information
- Application Number
- TW114111648
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-03-27
- Publication Date
- 2026-10-01
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Figure TWG2TA001077903_001 
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Figure TWG2TA001077903_003
Abstract
This invention can shorten the maintenance time required to remove the plated metal from the power supply pins. The maintenance fixture 490 is used to remove the metal film deposited on the power supply pins 442-4 of the substrate holder provided in the plating apparatus. The maintenance fixture 490 includes: a cathode chamber 492 configured to contain an electrolyte; a cathode 493 disposed in the cathode chamber 492 and configured to be subjected to a voltage between it and the power supply pins 442-4; and a diaphragm 494 having a first surface 494a in contact with the electrolyte in the cathode chamber 492 and a second surface 494b in contact with the power supply pins 442-4 when the maintenance fixture 490 is placed in the substrate holder. The diaphragm 494 is configured to retain the electrolyte in the cathode chamber 492 and allow anions to pass through from the first surface 494a side to the second surface 494b side.
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