Monocrystalline silicon wafer and method for the thermal treatment of same

TW202639982APending Publication Date: 2026-10-01SILTRONIC AG
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Patent Information

Application Number
TW115106192
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-22
Filing Date
2026-02-13
Publication Date
2026-10-01

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Abstract

s; and (iii) cooling the wafer at a cooling rate of not less than 10°C / s and not more than 50°C / s; characterized in that steps (i) to (iii) are performed in an atmosphere having an oxygen partial pressure of not less than
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