heat spreader

Abstract

A heat spreader includes a first metal plate, a second metal plate, and a partition structure. The partition structure is disposed between a surface of the first metal plate and a surface of the second metal plate. The partition structure includes a first cavity wall structure, a second cavity wall structure, an output channel structure, and a return channel structure. The area surrounded by the first cavity wall structure includes a first chamber; the area surrounded by the second cavity wall structure includes a second chamber; the output channel structure includes a confluence section and an acceleration section, the confluence section connecting to the first chamber; the acceleration section includes an expansion section connecting to the second chamber; the return channel structure has a plurality of capillary channels, an inlet end of each capillary channel connecting to the second chamber, and an outlet end of each capillary channel connecting to the first chamber.

Description

Technical Field

[0001] This invention relates to heat dissipation devices, particularly a heat spreader. Prior Technology

[0002] The heat spreader is a sheet-like structure comprising an upper plate and a lower plate. Between the upper plate and the lower plate is a vacuum chamber and a mesh structure. The vacuum chamber is filled with a small amount of liquid. When the lower plate comes into contact with a heat source, the small amount of liquid in the vacuum chamber carries away a large amount of heat and rapidly boils and evaporates into gas. It then condenses into droplets at a more distant end and is collected back to the position of the lower plate in contact with the heat source through the mesh structure, completing the heat dissipation cycle.

[0003] With the continuous development of technology, the demand for heat sinks for various products is increasing day by day. As various electronic products begin to develop towards lighter weight and thinner size, the requirements for the size of heat sinks are also increasing accordingly. Heat sinks are becoming thinner and thinner to meet the demand for lightweighting, and the distance between the upper plate and the lower plate is also narrower. The size of the vacuum chamber is compressed to a considerable extent. In the past, the liquid in the heat sink could diffuse into the entire vacuum chamber after being heated and turning into vapor. However, in the thin heat sink, the liquid turns into vapor after being heated and turns into vapor. Due to the narrow vacuum chamber and the influence of back pressure, the vapor cannot effectively diffuse into the entire vacuum chamber, making the vapor far from the heat source very thin. This also means that only the part of the thin heat sink is working near the heat source, while other parts cannot effectively dissipate heat, which will lead to a significant decline in heat dissipation efficiency.

[0004] Therefore, it is clear that how to make the heat dissipation plate have good heat dissipation efficiency is an urgent problem for all manufacturers to solve. Summary of the Invention

[0005] In view of this, the object of the present invention is to provide a heat dissipation plate with good heat dissipation efficiency.

[0006] To achieve the above objectives, the present invention provides a heat spreader, comprising a first metal plate, a second metal plate, and a partition structure, wherein the first metal plate has a surface; the second metal plate has a surface, the periphery of the second metal plate is joined to the periphery of the first metal plate, and the surface of the second metal plate faces the surface of the first metal plate; the partition structure is disposed between the surface of the first metal plate and the surface of the second metal plate.

[0007] The partition structure includes a first cavity wall structure, a second cavity wall structure, an output channel structure, and a return channel structure, wherein:

[0008] The area surrounded by the first cavity wall structure includes a first chamber, which has a first outlet and a first inlet;

[0009] The area surrounded by the second cavity wall structure includes a second chamber, which has a second inlet and a second outlet.

[0010] The output channel structure has a first end and a second end. The first end connects to the first outlet of the first chamber, and the second end connects to the second inlet of the second chamber. The output channel structure includes a confluence section and an acceleration section. One end of the confluence section forms the first end and connects to the first outlet of the first chamber. The other end of the confluence section connects to one end of the acceleration section. The width of the confluence section gradually narrows from the direction away from the first outlet. The acceleration section includes an expansion section with the second end, and the width of the expansion section gradually widens towards the second inlet of the second chamber.

[0011] The reflux channel structure has a plurality of capillary channels, with one inlet end of each capillary channel connected to the second outlet of the second chamber, and one outlet end of each capillary channel connected to the first inlet of the first chamber.

[0012] The advantage of this invention is that the heat exchanger includes a first chamber and a second chamber, which exchange heat through the output channel structure and the return channel structure. Unlike the previous single chamber, the dual-chamber design allows all spaces to work together to dissipate heat, thus fully utilizing the heat dissipation efficiency of the heat exchanger. Simple Explanation of the Diagram

[0013] Figure 1 is a flowchart of a method for manufacturing a heat spreader according to a first preferred embodiment of the present invention. Figure 2 is a schematic diagram of the manufacturing method of the heat spreader plate according to the first preferred embodiment of the present invention, showing a first pattern screen and a first metal plate printed and cured through the first pattern screen. Figure 3 is a schematic diagram of the manufacturing method of the heat spreader plate according to the first preferred embodiment of the present invention, showing a second pattern screen and a first metal plate printed and cured through the second pattern screen. Figure 4 is a schematic diagram of the manufacturing method of the heat spreader plate according to the first preferred embodiment of the present invention, showing a third pattern screen and a second metal plate printed and cured through the third pattern screen. Figure 5 is a schematic diagram of the manufacturing method of the heat spreader plate according to the first preferred embodiment of the present invention, showing that the first mesh and the second mesh are respectively placed into the first chamber and the second chamber, and the second metal plate is assembled with the first metal plate. Figure 6 is a schematic diagram of the manufacturing method of the heat spreader plate according to the first preferred embodiment of the present invention, showing that the periphery of the second metal plate and the periphery of the first metal plate are welded. Figure 7 shows the cross-sectional structure of various parts of the heat spreader in the first preferred embodiment of the present invention, wherein (a) is a cross-sectional schematic diagram of the first chamber, (b) is a cross-sectional schematic diagram of the output channel structure, (c) is a cross-sectional schematic diagram of the second chamber, and (d) is a cross-sectional schematic diagram of the return channel structure. Figure 8 is a schematic diagram of the flow direction inside the heat spreader of the first preferred embodiment of the present invention. Figure 9 is a schematic diagram of the manufacturing method of the heat spreader plate according to the second preferred embodiment of the present invention, revealing a second pattern screen and a first metal plate printed and cured through the second pattern screen. Figure 10 is a schematic diagram of the manufacturing method of the heat spreader plate according to the second preferred embodiment of the present invention, showing that the first mesh and the second mesh are respectively placed into the first chamber and the second chamber, and the second metal plate is assembled with the first metal plate. Figure 11 is a schematic diagram of the heat spreader of the second preferred embodiment of the present invention, showing a cross-sectional schematic diagram of the first chamber. Figure 12 is a schematic diagram of the manufacturing method of the heat spreader plate according to the third preferred embodiment of the present invention, showing that the first mesh and the second mesh are respectively placed into the first chamber and the second chamber, and the second metal plate is assembled with the first metal plate. Figure 13 is a schematic diagram of a heat spreader plate according to the fourth preferred embodiment of the present invention, showing that the heat spreader plate has a hollow area. Figure 14 is a schematic diagram of a method for manufacturing a heat spreader plate according to a fifth preferred embodiment of the present invention, showing that the first metal plate is 3D printed through a print head. Figure 15 is a schematic diagram of the manufacturing method of the heat spreader plate according to the sixth preferred embodiment of the present invention, showing that the liquid absorption sheet is placed between the first metal plate and the second metal plate, and the second metal plate is assembled with the first metal plate. Figure 16 is a schematic diagram of a heat spreader plate according to a sixth preferred embodiment of the present invention, wherein the second metal plate is hidden. Figure 17 is a schematic diagram of steam passing through a support column in the sixth preferred embodiment of the present invention. Figure 18 is a schematic diagram of the heat spreader of the seventh preferred embodiment of the present invention. Figure 19 is a schematic diagram of the heat spreader of the eighth preferred embodiment of the present invention. Figure 20 is a schematic diagram of a heat spreader plate according to the ninth preferred embodiment of the present invention, wherein the second metal plate is hidden. Figure 21 is a schematic diagram of a heat spreader plate according to the tenth preferred embodiment of the present invention, wherein the second metal plate is hidden. Figure 22 is a schematic diagram of the heat spreader of the eleventh preferred embodiment of the present invention, wherein the second metal plate is hidden. Implementation

[0014] To more clearly illustrate this invention, preferred embodiments are described in detail below with reference to the accompanying drawings. Please refer to Figure 1, which shows a method for manufacturing a vapor chamber and the vapor chamber itself according to a first preferred embodiment of the present invention. In this embodiment, the vapor chamber is manufactured through a printing step S1, a curing step S2, and an assembly step S3. The manufacturing method of the vapor chamber and the structure of the vapor chamber 1 will then be described in conjunction with Figures 2 to 8.

[0015] Please refer to Figures 2 to 4 and Figure 7 for the manufacturing method of the heat spreader. A first metal plate 10 and a second metal plate 30 are selected as the substrates to be printed. The thickness of the first metal plate 10 is a pitch D1, which is between 0.03 mm and 0.1 mm. The thickness of the second metal plate 30 is a pitch D2, which is between 0.03 mm and 0.1 mm. In this embodiment, the pitch D1 of the first metal plate 10 is 0.05 mm and the pitch D2 of the second metal plate 30 is 0.05 mm. The first metal plate 10 and the second metal plate 30 are exemplified by copper plates, but are not limited thereto and can also be stainless steel plates or other metal plates.

[0016] A first pattern screen O1, a second pattern screen O2, and a third pattern screen O3 are selected as the screens used in printing. Referring to Figure 2, the first pattern screen O1 includes a first cavity wall mesh area O11, a second cavity wall mesh area O12, an output channel mesh area O13, and a return channel mesh area O14. Referring to Figure 3, the second pattern screen O2 includes a second cavity support structure mesh area O21. Referring to Figure 4, the third pattern screen O3 includes a first cavity support structure mesh area O31.

[0017] A first printing material, a second printing material, and a third printing material are selected as the printing materials used in the printing process. The materials of the first, second, and third printing materials include thermosetting plastic materials, such as epoxy resin, phenolic resin, and silicone resin. In one embodiment, these printing materials may also include curable resins, preferably resins curable at temperatures below 150 degrees Celsius, such as epoxy resin. The materials of the first, second, and third printing materials can be the same, or their composition can be adjusted according to the purpose. In this embodiment, the first, second, and third printing materials are the same and all contain epoxy resin, which can be a single-component epoxy resin or a two-component epoxy resin. The single-component epoxy resin includes epoxy resin, diluent, silica, and the additive carbon black. Unlike two-component epoxy resins, single-component epoxy resins do not cure immediately but harden after baking; therefore, heating can be used as a curing method. Silicon dioxide enhances the toughness of cured single-component epoxy resins, while carbon black is used for filling and color modification. Diluents, such as benzene and xylene, are used to reduce the viscosity of single-component epoxy resins, but are not limited to these. Two-component epoxy resins are cured at room temperature to complete the cross-linking reaction; therefore, a waiting time at room temperature can be used as a curing method. Both single-component and two-component epoxy resins exhibit good thermal conductivity after curing, making them suitable for heat conduction in vapor chamber 1.

[0018] Please refer to Figures 2 and 7. The printing step S1 includes: printing the first printing material onto a surface 10a of the first metal plate 10 through the first pattern screen O1. The first printing material passes through the first cavity wall mesh area O11, the second cavity wall mesh area O12, the output channel mesh area O13, and the return channel mesh area O14, so that the first printing material forms a first printing pattern P1 on the surface 10a of the first metal plate 10. The first printing pattern P1 includes a first cavity wall pattern P11, a second cavity wall pattern P12, an output channel pattern P13, and a return channel pattern P14.

[0019] The curing step S2 includes a curing method, such as heating the first metal plate 10 having the first printed pattern P1, which can be placed in an oven for heating. The heating temperature and time required will vary depending on the amount used and the size of the material. Generally, the heating temperature is controlled below 150 degrees Celsius to avoid oxidation or deformation of the first metal plate 10 or the second metal plate 30. In this embodiment, the heating temperature can be, for example, 120 degrees Celsius and the heating time can be, for example, 1 hour, so that the first printed pattern P1 is cured to form a partition structure 20, and the first cavity wall pattern P11 is cured. The process involves solidifying a first cavity wall structure 21; solidifying the second cavity wall pattern P12 to form a second cavity wall structure 22; solidifying the output channel pattern P13 to form an output channel structure 23; and solidifying the return channel pattern P14 to form a return channel structure 24. The partition structure 20 includes the first cavity wall structure 21, the second cavity wall structure 22, the output channel structure 23, and the return channel structure 24. The thickness of the partition structure 20 is a spacing D3, which is between 0.1 mm and 0.15 mm. In this embodiment, the spacing D3 is 0.1 mm. The aforementioned heating temperature and heating time are merely illustrative examples; in practice, they can be adjusted according to the characteristics of the printing material used.

[0020] Please refer to Figures 3 and 7. The printing step S1 includes: printing the second printing material onto the surface 10a of the first metal plate 10 through the second pattern screen O2, so that the second printing material passes through the mesh area O21 of the second chamber support structure, so that the second printing material forms a second printing pattern P2 in the area enclosed by the second chamber wall structure 22 on the surface 10a of the first metal plate 10, and the second printing pattern P2 includes a second chamber support pattern P21.

[0021] The curing step S2 includes: heating the first metal plate 10 having the second printed pattern P2 to cure the second printed pattern P2, and curing the second chamber support pattern P21 to form a second chamber support structure 70. The thickness of the second chamber support structure 70 is a spacing D7, which is between 0.05mm and 0.1mm. In this embodiment, the spacing D7 is 0.05mm. The thickness of the second printed pattern P2 is less than the thickness of the first printed pattern P1, and the thickness of the second chamber support structure 70 is less than the thickness of the partition structure 20.

[0022] Please refer to Figures 4 and 7. The printing step S1 includes: printing the third printing material onto a surface 30a of the second metal plate 30 through the third pattern screen O3, allowing the third printing material to pass through the mesh area O31 of the first chamber support structure, so that the third printing material forms a third printing pattern P3 on the surface 30a of the second metal plate 30, and the third printing pattern P3 includes a first chamber support pattern P31.

[0023] The curing step S2 includes: heating the second metal plate 30 having the third printed pattern P3 to cure the third printed pattern P3, and curing the first chamber support pattern P31 to form a first chamber support structure 60. The thickness of the first chamber support structure 60 is a spacing D6, which is between 0.05mm and 0.1mm. In this embodiment, the spacing D6 is 0.05mm. The thickness of the third printed pattern P3 is less than the thickness of the first printed pattern P1; the thickness of the first chamber support structure 60 is less than the thickness of the partition structure 20.

[0024] In the above-described printing step S1 and curing step S2, the printing order of the first metal plate 10 and the second metal plate 30 is not limited to the above description. In addition, the heating order of the first metal plate 10 and the second metal plate 30 is also not limited to the above description.

[0025] Please refer to Figures 5 to 7. The manufacturing method of the heat spreader includes selecting a liquid-absorbing element. In this embodiment, the liquid-absorbing element includes two liquid-absorbing sheets, which are respectively exemplified by a first mesh sheet 40 and a second mesh sheet 50. The first mesh sheet 40 and the second mesh sheet 50 serve as the mesh structure of the heat spreader 1. The thickness of the first mesh sheet 40 is a spacing D4, which is between 0.03 mm and 0.06 mm. The thickness of the second mesh sheet 50 is a spacing D5, which is between 0.03 mm and 0.06 mm. In this embodiment, both the first mesh sheet 40 and the second mesh sheet 50 are metal meshes, such as copper meshes. The thickness of the first mesh sheet 40 is 0.045 mm, and the thickness of the second mesh sheet 50 is 0.045 mm. In one embodiment, each liquid-absorbing sheet can also be made of fiber material, such as non-woven fabric, but is not limited thereto; it can also be made of fabric.

[0026] The assembly step S3 includes: laying the first mesh 40 in the area surrounded by the first cavity wall structure 21 of the first metal plate 10. In this embodiment, the first mesh 40 is attached with a coolant L, wherein the coolant L can be one or a mixture of water, alcohol, acetic acid, and acetone; then laying the second mesh 50 in the area surrounded by the second cavity wall structure 22, the second mesh 50 being located above the second cavity support structure 70; and then joining the periphery of the first metal plate 10 and the second metal plate 30, with the first cavity support structure 60 of the second metal plate 30 corresponding to the first metal plate 10. During the process of joining the area enclosed by the first cavity wall structure 21 of the metal plate 10, the space between the first metal plate 10 and the second metal plate 30 is evacuated to a vacuum or low pressure, so that the partition structure 20 presses against the surface 30a of the second metal plate 30. The joining method can be gluing, welding, locking, etc., and the welding can be laser welding, solid welding, roll welding or diffusion welding, etc., thereby forming the heat dissipation plate 1. The thickness of the heat dissipation plate 1 is a spacing D, which is less than 0.35 mm, preferably less than 0.2 mm, and more preferably 0.16 mm.

[0027] In one embodiment, in the assembly step S3, the first mesh 40 laid on the first metal plate 10 may not initially have coolant L attached to it. Instead, during the air extraction process, coolant L is injected between the first metal plate 10 and the second metal plate 30, so that coolant L is attached to the first mesh 40.

[0028] By means of the first preferred embodiment of the above-described method for manufacturing a heat spreader, the heat spreader 1 of the first preferred embodiment can be obtained. The structure of the heat spreader 1 will be described below.

[0029] Please refer to Figures 5 to 8. The heat spreader 1 includes the first metal plate 10, the partition structure 20, the second metal plate 30, the liquid absorption element (the first mesh 40 and the second mesh 50), the first chamber support structure 60, and the second chamber support structure 70. The first metal plate 10 has the surface 10a, and the second metal plate 30 has the surface 30a. The periphery of the second metal plate 30 is connected to the periphery of the first metal plate 10, and the surface 30a of the second metal plate 30 faces the surface 10a of the first metal plate 10. The partition structure 20 is located between the surface 10a of the first metal plate 10 and the surface 30a of the second metal plate 30. In this embodiment, the partition structure 20 is disposed on the surface 10a of the first metal plate 10 and abuts against the surface 30a of the second metal plate 30.

[0030] The partition structure 20 includes the first cavity wall structure 21, the second cavity wall structure 22, the output channel structure 23, and the return channel structure 24. The area surrounded by the first cavity wall structure 21 includes the first chamber 211. The first chamber 211 has a first outlet 212 and a first inlet 213. The first outlet 212 communicates with the output channel structure 23, and the first inlet 213 communicates with the return channel structure 24. The first mesh 40 of the liquid suction member is attached to the coolant L and laid in the first chamber 211. The first mesh 40 is flush with the first inlet 213. The first chamber support structure 60 is disposed on the surface 30a of the second metal plate 30 and located in the first chamber 211. The first chamber support structure 60 abuts against the side of the first mesh 40 facing the second metal plate 30. The first chamber support structure 60 is located between the first metal plate 10 and the second metal plate 30. The thickness of the first chamber support structure 60 is less than the thickness of the partition structure 20. The first chamber support structure 60 includes a plurality of support columns, such as a plurality of first protrusions 61, with gaps between these first protrusions 61 to allow the vapor of the coolant L to flow. In this embodiment, each of the first protrusions 61 is a cylinder, but it is not limited thereto; it can also be a polygonal column, an elliptical column, or a teardrop-shaped column, etc.

[0031] The area surrounded by the second cavity wall structure 22 includes a second chamber 221, which has a second inlet 222 and a second outlet 223. The second inlet 222 connects to the output channel structure 23, and the second outlet 223 connects to the return channel structure 24. The second mesh 50 is laid in the second chamber 221 and is flush with the second outlet 223. The second chamber support structure 70 is located between the first metal plate 10 and the second metal plate 30. The second chamber support structure 70 is disposed on the surface 10a of the first metal plate 10 and located in the second chamber 221. The second chamber support structure 70 abuts against the side of the second mesh 50 facing the first metal plate 10. The thickness of the second chamber support structure 70 is less than the thickness of the partition structure 20. The second chamber support structure 70 includes a plurality of support columns, such as a plurality of second protrusions 71, with gaps between these second protrusions 71 to allow the vapor of the coolant L to flow. In this embodiment, each of the second protrusions 71 is a cylinder, but it can also be a polygonal column, an elliptical column, or a teardrop-shaped column, etc.

[0032] The output channel structure 23 has a first end 23a and a second end 23b. The first end 23a is connected to the first outlet 212 of the first chamber 211, and the second end 23b is connected to the second inlet 222 of the second chamber 221. The output channel structure 23 includes a confluence section 231, an acceleration section 232, and a plurality of support columns 233. The confluence section 231 and the acceleration section 232 constitute an acceleration channel. One end of the confluence section 231 forms the first end 23a and is connected to the first outlet 212 of the first chamber 211. The other end of the confluence section 231 is connected to... At one end of the acceleration section 232, the width of the confluence section 231 gradually narrows from the direction away from the first outlet 212; the width of the acceleration section 232 is smaller than the width of the confluence section 231, and the other end of the acceleration section 232 is connected to the second inlet 222 of the second chamber 221. The support columns 233 form a support structure and are located between the first metal plate 10 and the second metal plate 30. The support columns 233 are disposed in the confluence section 231 and the acceleration section 232, and there are gaps between the support columns 233 to allow the vapor of the coolant L to flow. The acceleration section 232 includes a throat 232a and an expansion section 232b. The throat 232a connects the expansion section 232b to the confluence section 231. The expansion section 232b has a second end 23b, and its width gradually increases towards the second inlet 222 of the second chamber 221. The throat 232a is the narrowest point between the first end 23a and the second end 23b. In this embodiment, the throat 232a is an elongated shape of equal width, and its length is greater than the length of the expansion section 232b.

[0033] The reflux channel structure 24 has an outer side wall 241, an inner side wall 242, and a plurality of channel walls 243. The outer side wall 241 is disposed on the outer edge of the first metal plate 10, the inner side wall 242 is disposed on the inner side of the first metal plate 10, and the channel walls 243 are disposed between the outer side wall 241 and the inner side wall 242. The outer side wall 241, the inner side wall 242, and each of the channel walls 243 respectively contact the surface 10a of the first metal plate 10 and the surface 30a of the second metal plate 30, such that a plurality of capillary channels 244 are formed between the outer side wall 241, the channel walls 243, and the inner side wall 242. Each capillary channel 244 has an inlet end 244a connected to the second outlet 223 of the second chamber 221, and an outlet end 244b connected to the first inlet 213 of the first chamber 211. The outlet ends 244b and inlet ends 244a of the capillary channels 244 are adjacent to the first mesh 40 and the second mesh 50, respectively, which can greatly improve the effectiveness of capillary action. The length of the outer wall 241 is greater than the length of any channel wall 243, and the length of any channel wall 243 is greater than the inner wall 242. The length of the channel walls 243 gradually shortens from the direction away from the outer wall 241 towards the inside.

[0034] Please refer to Figure 8. When in use, the heat spreader 1 contacts a heat source H, such as an integrated circuit element, with the first metal plate 10 facing the first chamber 211. When the first chamber 211 is heated by the heat source H in contact with the first metal plate 10, the coolant L attached to the first mesh 40 boils and evaporates into vapor. The vapor diffuses between the first protrusions 61, and most of the diffused vapor flows into the first outlet 212 with a larger opening (but not into the capillary channel 244 with an extremely narrow opening). After entering the output channel structure 23, the vapor flows from the confluence section 231 into the acceleration section 232. As the channel width gradually narrows, the speed of the vapor also increases, thus quickly passing through the output channel. Structure 23, through the second inlet 222, is injected into the second chamber 221. Vapor diffuses through the gaps between the second protrusions 71 into the entire second chamber 221. The vapor contacts the second mesh 50 and condenses upon contact with the cold air. The condensed droplets are attracted by the capillary action of the return channel structure 24, flow into the second outlet 223, and enter the capillary channels 244. The droplets flow back to the first chamber 211 through the capillary channels 244 and diffuse from the edge of the first mesh 40 to the entire first mesh 40, thus completing the heat dissipation cycle. In this embodiment, since the first mesh 40 is abutted against the surface 10a of the first metal plate 10, the heat generated by the heat source H can be directly conducted from the first metal plate 10 to the first mesh 40, thereby accelerating the boiling and evaporation efficiency of the coolant L. Conventional thin vapor chambers are limited by their narrow thickness, making it difficult for vapor to diffuse throughout the entire chamber. The vapor becomes thinner the further away from the heat source, resulting in only a portion of the chamber being used for heat dissipation, while other parts of the chamber are not included in the overall heat dissipation cycle. In contrast, the vapor chamber 1 of this invention, in addition to the first chamber 211, adds a second chamber 221, an output channel structure 23, and a return channel structure 24. The height of the gap between the support columns 233 in the output channel structure 23 is greater than the height of the gap between the first protrusions 61 in the first chamber 211, allowing vapor to flow more easily from the first chamber 211 into the output channel structure 23. It also allows vapor to be transferred from the first chamber 211 to the second chamber 221 through the output channel structure 23. The second chamber 221 can fully utilize the entire space for cooperative heat dissipation, allowing vapor to move away from the heat source H and guiding the condensed droplets back to the first chamber 211 through the return channel structure 24.

[0035] In addition to contacting the heat source H with the first metal plate 10 corresponding to the first chamber 211, the second metal plate 30 can also contact the heat source H with the first chamber 211.

[0036] Please refer to Figures 9 to 11, which show a method for manufacturing a heat spreader according to a second preferred embodiment of the present invention. The difference between the second preferred embodiment and the first preferred embodiment is that only the first pattern screen O1 and a second pattern screen O2' are needed, and the third pattern screen O3 is not needed. The printing process of the first pattern screen O1 is the same as described above and will not be repeated. The printing process of the second pattern screen O2' will be described below.

[0037] The printing step S1 includes: printing the second printing material onto the surface 10a of the first metal plate 10 through the second pattern screen O2', wherein the second printing material passes through a first chamber support structure mesh area O21' and a second chamber support structure mesh area O22', so that the second printing material forms a second printing pattern P2' in the area enclosed by the first chamber wall structure 21 and the area enclosed by the second chamber wall structure 22 on the surface 10a of the first metal plate 10, wherein the second printing pattern P2' includes the first chamber support pattern P21' and the second chamber support pattern P22'.

[0038] The curing step S2 includes: heating the first metal plate 10 having the second printed pattern P2' to cure the second printed pattern P2', curing the first chamber support pattern P21' to form the first chamber support structure 60, and curing the second chamber support pattern P22' to form the second chamber support structure 70.

[0039] Assembly step S3 includes: laying the first mesh sheet 40 in the area surrounded by the first cavity wall structure 21 of the first metal plate 10, with the first mesh sheet 40 located above the first cavity support structure 60 and the coolant L attached to it; then laying the second mesh sheet 50 in the area surrounded by the second cavity wall structure 22, with the second mesh sheet 50 located above the second cavity support structure 70; then using methods such as gluing, welding, and locking, combining the periphery of the first metal plate 10 and the second metal plate 30, and evacuating the space between the first metal plate 10 and the second metal plate 30 to a vacuum, so that the partition structure 20 presses against the surface 30a of the second metal plate 30, thereby forming a heat spreader 2. The second embodiment uses only two mesh sheets, making the process simpler and faster than the first embodiment.

[0040] By means of the second preferred embodiment of the above-described method for manufacturing a heat spreader, the heat spreader 2 of the second preferred embodiment can be obtained. The structure of the heat spreader 2 will be described below.

[0041] Please refer to Figures 9 to 11. The second preferred embodiment differs from the first preferred embodiment in that the first chamber support structure 60 is disposed on the surface 10a of the first metal plate 10 and located in the first chamber 211, and the first chamber support structure 60 abuts against the side of the first mesh 40 facing the first metal plate 10.

[0042] Please refer to Figure 12, which shows a method for manufacturing a heat spreader according to a third preferred embodiment of the present invention. The difference between this third preferred embodiment and the first preferred embodiment is that only the first pattern screen O1 needs to be printed, and the second pattern screen O2 and the third pattern screen O3 are not required. The printing process of the first pattern screen O1 will be described below.

[0043] The printing step S1 includes: printing the first printing material onto the surface 10a of the first metal plate 10 through the first pattern screen O1, so that the first printing material forms the first printing pattern P1 on the surface 10a of the first metal plate 10.

[0044] The curing step S2 includes: heating the first metal plate 10 having the first printed pattern P1 to cure the first printed pattern P1 to form a partition structure 20, the partition structure 20 including the first cavity wall structure 21, the second cavity wall structure 22, the output channel structure 23 and the return channel structure 24.

[0045] The assembly step S3 includes: laying the first mesh sheet 40 in the area surrounded by the first cavity wall structure 21 of the first metal plate 10, with the coolant L attached to the first mesh sheet 40; then laying the second mesh sheet 50 in the area surrounded by the second cavity wall structure 22; then using methods such as gluing, welding, and locking, combining the periphery of the first metal plate 10 and the second metal plate 30, and evacuating the space between the first metal plate 10 and the second metal plate 30 to a vacuum, so that the partition structure 20 presses against the surface 30a of the second metal plate 30, thereby forming a heat spreader 3. In the third embodiment, only one mesh sheet is used, which simplifies the process compared to the first embodiment and makes the manufacturing process faster.

[0046] By means of the third preferred embodiment of the above-described method for manufacturing a heat spreader, the heat spreader 3 of the third preferred embodiment can be obtained. The structure of the heat spreader 3 will be described below.

[0047] Please refer to Figure 12. The difference between the heat spreader 3 of the third preferred embodiment of the present invention and the first preferred embodiment is that the heat spreader 3 does not have the first chamber support structure 60 and the second chamber support structure 70. In this embodiment, the first mesh 40 and the second mesh 50 simultaneously serve as both mesh structures and support structures.

[0048] Please refer to Figure 13, which shows a method for manufacturing a heat spreader according to a fourth preferred embodiment of the present invention. The difference between this fourth preferred embodiment and the first preferred embodiment is that the first metal plate 10 further includes a first hollow area 11, and the second metal plate 30 further includes a second hollow area 31. During assembly, the periphery of the first metal plate 10 and the periphery of the second metal plate 30 are combined by means of gluing, welding, locking, etc., and the periphery of the second hollow area 31 and the periphery of the first hollow area 11 need to be combined accordingly to form a hollow area 80.

[0049] By means of the fourth preferred embodiment of the above-described method for manufacturing a heat spreader, the heat spreader 4 of the fourth preferred embodiment can be obtained. The structure of the heat spreader 4 will be described below.

[0050] Please refer to Figure 13. The difference between the heat spreader 4 of the fourth preferred embodiment of the present invention and the first preferred embodiment is that the first metal plate 10 further includes a first hollow area 11. The first hollow area 11 is surrounded by the first cavity wall structure 21, the second cavity wall structure 22, the output channel structure 23, and the return channel structure 24. The second metal plate 30 further includes a second hollow area 31, which corresponds to the first hollow area 11. The periphery of the second hollow area 31 and the periphery of the first hollow area 11 are combined to form a hollow area 80. Because this embodiment lacks the hollow area 80, the heat spreader 4 can be made lighter, achieving the effect of weight reduction.

[0051] Please refer to Figure 14, which shows a method for manufacturing a heat spreader according to a fifth preferred embodiment of the present invention. The difference between the fifth preferred embodiment and the first preferred embodiment is that the fifth preferred embodiment does not use screen printing but uses a printing method, such as 3D printing. The print head G1 can print the patterns of the partition structure 20, the first chamber support structure 60 and the second chamber support structure 70 on the first metal plate 10 and / or the second metal plate 30 of the heat spreader. After the assembly step, the same effect can be achieved.

[0052] By means of the fifth preferred embodiment of the above-described method for manufacturing a heat spreader, the heat spreader 5 of the fourth preferred embodiment can be obtained. The structure of the heat spreader 5 will be described below.

[0053] Please refer to Figure 14. The difference between the heat spreader 5 of the fifth preferred embodiment of the present invention and the first preferred embodiment is that 3D printing can create more complex geometric structures than ordinary printing, and it is also easier to make fine adjustments at the detail level, thus making the operation more flexible.

[0054] Figures 15 to 17 show a heat spreader 6 of a sixth preferred embodiment of the present invention, which has a structure substantially the same as that of the first embodiment. The difference between this embodiment and the first embodiment lies in the different patterns formed on the first metal plate 10 and the second metal plate 30. More specifically, in this embodiment, the outer sidewall 241 and the inner sidewall 242 of the first cavity wall structure 21, the second cavity wall structure 22, the output channel structure 23, and the return channel structure 24 of the partition structure 20 are disposed on the surface 10a of the first metal plate 10. The channel walls 243, the first chamber support structure 60, and the second chamber support structure 70 of the return channel structure 24 are disposed on the surface 30a of the second metal plate 30.

[0055] In addition, the liquid-absorbing element in this embodiment is a liquid-absorbing sheet 82, which is laid in the capillary channels 244 of the first chamber 211, the second chamber 221, and the return channel structure 24. The liquid-absorbing sheet 82 includes a first segment 821, a second segment 822, and a third segment 823, with the third segment 823 connecting the first segment 821 and the second segment 822. The first segment 821 is laid in the first chamber 211, the second segment 822 is laid in the second chamber 221, and the third segment 823 is laid in the capillary channels 244 of the return channel structure 24. The liquid-absorbing sheet 82 is made of fiber material; in this embodiment, it is non-woven fabric, but this is not a limitation, and the liquid-absorbing sheet 82 can also be made of fabric. In other embodiments, the liquid-absorbing sheet 82 can also be a metal mesh, such as a copper mesh.

[0056] The thickness of the channel walls 243, the first chamber support structure 60, the second chamber support structure 70, etc., of the reflux channel structure 24 disposed on the surface 30a of the second metal plate 30 is less than the thickness of the first chamber wall structure 21, the second chamber wall structure 22, the output channel structure 23, and the outer side wall 241 and the inner side wall 242 of the reflux channel structure 24 disposed on the surface of the first metal plate 10. Therefore, the liquid absorption sheet 82 can be accommodated between the surface 10a of the first metal plate 10 and the channel walls 243, the first chamber support structure 60, and the second chamber support structure 70 of the reflux channel structure 24.

[0057] Compared to the first embodiment, in this embodiment, the throat 232a of the acceleration section 232 of the output channel structure 23 is shorter. The expansion section 232b is directly formed downstream of the throat 232a in the acceleration section 232. The width of the expansion section 232b gradually widens from the throat 232a toward the second inlet 222 of the second chamber 221. In this embodiment, the length of the confluence section 231 is less than the length of the expansion section 232b, and the degree of gradual narrowing of the width of the confluence section 231 is sharper than the degree of gradual widening of the width of the expansion section 232b. This allows the vapor in the first chamber 211 to be rapidly concentrated in the throat 232a of the acceleration section 232, and then the vapor is accelerated and travels through the expansion section 232b of the acceleration section 232 before being output to the second chamber 221.

[0058] As shown in Figure 17, in this embodiment, the support columns 233 of the output channel structure 23 are raindrop-shaped columns. Each support column 233 has an arc end 233a and a pointed tip 233b. The arc end 233a faces the first chamber 211, and the pointed tip 233b faces the second chamber 221. Therefore, when steam flows through the confluence section 231 and the acceleration section 232, it can proceed from the arc end 233a of each support column 233 along the outer periphery and pass through the pointed tip 233b. Furthermore, turbulence is less likely to occur downstream of the pointed tip 233b, effectively preventing the steam from slowing down due to turbulence, thus achieving a smoother flow of steam or coolant.

[0059] Each support column 62 of the first chamber support structure 60 and each support column 72 of the second chamber support structure 70 are also teardrop-shaped columns with an arc end 62a, 72a and a pointed tip 62b, 72b. The pointed tip 62b of each support column 62 of the first chamber support structure 60 faces the confluence section 231 of the output channel structure 23. The arc end 72a of each support column 72 of the second chamber support structure 70 faces the acceleration section 232 of the output channel structure 23. Both the support columns 62 of the first chamber support structure 60 and the support columns 72 of the second chamber support structure 70 can achieve the effect of smoother flow of steam or coolant.

[0060] In this embodiment, the first chamber 211 includes a main chamber 211a and a branch channel 211b. The main chamber 211a has a first outlet 212. The branch channel 211b is located on one side of the main chamber 211a and communicates with the outlet end 244b of the capillary channels 244. The first inlet 213 of the first chamber 211 is formed between the two ends of the branch channel 211b. The support columns 62 of the first chamber support structure 60 are distributed between the main chamber 211a and the branch channel 211b.

[0061] With the above architecture, the heat source H mainly corresponds to the main chamber 211a of the first chamber 211. The coolant L in the main chamber 211a boils and forms vapor, which enters the confluence section 231 of the output channel structure 23 and is then accelerated out by the acceleration section 232. After the vapor condenses in the second chamber 221, part of the condensed droplets are adsorbed onto the second section 822 of the absorbent plate 82 and permeate into the third section 823 of the absorbent plate 82, and then permeate into the first section 821 of the absorbent plate 82. The other part of the condensed droplets is attracted by the capillary action of the return channel structure 24 and enters the capillary channels 244, flowing back to the first chamber 211 with the capillary channels 244. By using the third section 823 of the absorbent plate 82 in conjunction with the capillary channels 244, the speed at which the coolant L returns to the first chamber 211 can be accelerated.

[0062] The main chamber 211a of the first chamber 211 is the main heating zone, and the resistance of the first outlet 212 is smaller than that of the branch channel 211b. Therefore, the steam generated in the main chamber 211a mainly enters the confluence section 231 directly through the first outlet 212, avoiding a large amount of steam from entering the capillary channels 244 through the outlet end 244b and affecting the return flow of the coolant L. Furthermore, of the two ends of the branch channel 211b, the end closer to the first outlet 212 is defined as a branch inlet end 211b1, and the end farther from the first outlet 212 is defined as a branch outlet end 211b2. The width of the branch inlet end 211b1 is greater than the width of the branch outlet end 211b2, and the width of the branch channel 211b gradually narrows from the branch inlet end 211b1 to the branch outlet end 211b2. In this way, when the vapor enters the branch channel 211b from the branch inlet end 211b1, it flows rapidly in the branch channel 211b and forms a low pressure at the first inlet 213. The low pressure draws the coolant L from the outlet ends 244b of each capillary channel 244 into the branch channel 211b and injects it into the main chamber 211a from the branch outlet end 211b2. In this way, the speed at which the coolant L flows back to the main chamber 211a can be increased.

[0063] The width of the outlet end 244b of each capillary channel 244 is smaller than the width of the inlet end 244a. This also prevents the vapor in the first chamber 211 from entering each capillary channel 244 through the outlet end 244b and affecting the return flow of the coolant L.

[0064] Figure 18 shows a heat spreader 7 of a seventh preferred embodiment of the present invention, which has a structure substantially the same as that of the sixth embodiment. The difference is that the partition structure 20, the first chamber support structure 60, the second chamber support structure 70, etc., are disposed on the surface 10a of the first metal plate 10 and have the same thickness. The liquid absorption sheet 82 is located between the structures on the surface 30a of the second metal plate 30 and the surface 10a of the first metal plate 10.

[0065] The heat spreader 7 in this embodiment can also achieve the effect of the sixth preferred embodiment, and will not be described again here.

[0066] Figure 19 shows a heat spreader 8 of an eighth preferred embodiment of the present invention, which has a structure substantially the same as that of the seventh embodiment. The difference is that the liquid absorber 82 further includes a fourth segment 824, which is connected to the first segment 821 and is laid in the confluence section 231 of the output channel structure 23. When the vapor generated in the first chamber 211 pushes part of the coolant L towards the confluence section 231 of the output channel structure 23, the fourth segment 824 of the liquid absorber 82 can absorb the coolant L in the confluence section 231, so as to recover the coolant L back to the first segment 821 and return it to the first chamber 211 for subsequent heat absorption. This prevents coolant L from accumulating in the throat 232a of the confluence section 231 or the acceleration section 232, thus avoiding resistance to vapor flow and preventing vapor generated in the first chamber 211 from entering the capillary channels 244 through the outlet 244b and affecting the return flow of coolant L.

[0067] The partition structure 20 further includes an outer support structure 84, which is located around the first cavity wall structure 21, the second cavity wall structure 22, the output channel structure 23, and the return channel structure 24, and is supported by the first metal plate 10 and the second metal plate 30. The outer support structure 84 is used to provide support between the first metal plate 10 and the second metal plate 30. When the thickness of the first metal plate 10 or the second metal plate 30 is relatively thin, the metal plate will be softer. Without the external support structure 84, when the air is evacuated to a vacuum or low pressure, the first metal plate 10 and the second metal plate 30 will be relatively close—the two surfaces 10a and 30a may also come into contact—resulting in a reduction of the vacuum or low pressure space. Therefore, the pressure fluctuation caused by the generation of vapor is relatively large, causing the vacuum level to drop and the boiling point temperature of the coolant L to rise. Conversely, with the external support structure 84 supporting the space between the surface 10a of the first metal plate 10 and the surface 30a of the second metal plate 30, the vacuum or low pressure space can be maintained when the air is evacuated to a vacuum or low pressure. Therefore, the pressure fluctuation caused by the generation of vapor is relatively small, the vacuum level drops less, and it is less likely to cause the boiling point temperature of the coolant L to drop. As a result, the coolant L in the first chamber 211 can be converted into vapor more quickly.

[0068] In this embodiment, the peripheral support structure 84 has a plurality of chambers 842. In this embodiment, the peripheral support structure 84 is honeycomb-shaped, and each chamber 842 is hexagonal, but not limited thereto; it can also be circular or polygonal. Adjacent chambers 842 can be interconnected to accelerate the pumping to a vacuum or low pressure, but not limited thereto; they can also be disconnected. The chambers 842 are not limited to a honeycomb arrangement; they can also be arranged in a matrix. In addition, the peripheral support structure 84 can also be a plurality of support columns, not limited to chambers. Optionally, the confluence section 231 of the output channel structure 23 is connected to some of the surrounding chambers 842, thereby reducing the pressure rise caused by the steam in the first chamber 211 and making it less likely for the boiling point temperature of the coolant L to drop.

[0069] The peripheral support structure 84 in this embodiment can also be applied to the above embodiments.

[0070] Figure 20 shows a heat spreader 9 of a ninth preferred embodiment of the present invention, which has a structure substantially the same as that of the seventh embodiment. The difference between this embodiment and the seventh embodiment lies in the different patterns formed on the first metal plate 10. More specifically, the partition structure 20 includes two first cavity wall structures 21, one second cavity wall structure 22, two output channel structures 23, one return channel structure 24, two first chamber support structures 60, and one second chamber support structure 70. The two first segments 821, the second segment 822, and the third segment 823 of the liquid absorption sheet 82 are laid in the capillary channels 244 of the two first chambers 211, the second chamber 221, and the return channel structure 24. Optionally, the two fourth segments 824 are further laid in the confluence section 231 of the two output channel structures 23.

[0071] The first chambers 211 of the two first cavity wall structures 21 correspond to two heat sources H located at different positions. The second cavity wall structure 22 is located next to a cooling device 200, which may be, for example, a cooling fan. The second chamber 221 is connected to the acceleration section 232 of the two output channel structures 23. The two output channel structures 23 accelerate and guide the vapor generated by the two first chambers 211 to the second chamber 221, thereby allowing the two heat sources H to share a single second chamber 221 for heat dissipation. The cooling device 200 can remove the heat energy from the second chamber 221, creating a relatively cold zone within the second chamber 221 and accelerating the condensation rate of the vapor.

[0072] Furthermore, the return channel structure 24 surrounds the periphery of each of the first cavity wall structures 21, the second cavity wall structure 22, and the output channel structure 23. Thus, when coolant L seeps out from each of the first cavity wall structures 21, the second cavity wall structure 22, and the output channel structure 23, the seeping coolant L can enter the capillary channels 244 of the return channel structure 24 and then flow back to each of the first chambers 211.

[0073] The partition structure 20 of this embodiment further includes a plurality of peripheral capillary channels 86, which are located on the periphery of the return channel structure 24 and connected to the outermost one of the capillary channels 244. Each peripheral capillary channel 86 has at least one inlet end 86a and at least one outlet end 86b. The inlet end 86a of each peripheral capillary channel 86 is open, and the outlet end 86b of each peripheral capillary channel 86 is connected to the outer wall 241 of the return channel structure 24. When the coolant L seeps out of the outer wall 241 from the capillary channels 244, the coolant L can be drawn back into the capillary channels 244 by the capillary action of the corresponding peripheral capillary channels 86, thereby effectively utilizing the coolant. The peripheral capillary channels 86 can also serve as peripheral support structures to support the first metal plate 10 and the second metal plate 30. Furthermore, in this embodiment, the outer wall 241 of the return channel structure 24 is provided with a plurality of pressure relief holes 241a surrounding the second cavity wall structure 22. These pressure relief holes 241a connect the second cavity 221 and the space surrounding the outer wall 241, and are used to relieve steam pressure within the second cavity 221. When the heat generated by each heat source H is large, resulting in excessive steam pressure output to the second cavity 221 and delayed condensation, the steam can be discharged to the surrounding space through these pressure relief holes 241a, thereby reducing the pressure in the second cavity 221 and allowing the steam output from the output channel structure 23 to flow smoothly into the second cavity 221. After the steam discharged to the surrounding space through these pressure relief holes 241a condenses, the coolant L can be drawn back to these capillary channels 244 through the capillary action of the corresponding peripheral capillary channels 86.

[0074] Figure 21 shows a heat spreader A according to a tenth preferred embodiment of the present invention, which has a structure substantially the same as that of the ninth embodiment, except that the pattern formed on the first metal plate 10 is different. More specifically, the partition structure 20 includes two first cavity wall structures 21, two second cavity wall structures 22, two output channel structures 23, two return channel structures 24, two first chamber support structures 60, and two second chamber support structures 70. That is, the partition structure 20 includes two sets of structures, each set of structures including a first cavity wall structure 21, a second cavity wall structure 22, an output channel structure 23, and a return channel structure 24, and the return channel structure 24 surrounds the periphery of the corresponding first cavity wall structure 21, the second cavity wall structure 22, and the output channel structure 23.

[0075] The liquid absorption component of the heat spreader A in this embodiment includes two liquid absorption plates 82. The first segment 821, the second segment 822, and the third segment 823 of each liquid absorption plate 82 are respectively laid in the first chamber 211, the second chamber 221, and the capillary channel 244 of each return channel structure 24. Optionally, each fourth segment 824 is further laid in the confluence section 231 of each output channel structure 23.

[0076] The first chambers 211 of the two first cavity wall structures 21 correspond to two heat sources H located at different positions. The two second cavity wall structures 22 are located next to two cooling devices 200 at different positions. In this way, the two cooling devices 200 can remove the heat energy from the two second chambers 221, so that the two second chambers 221 form two corresponding cold zones, thereby accelerating the condensation rate of steam.

[0077] In addition, the peripheral capillary channels 86 of this embodiment are connected to the outermost one of the capillary channels 244 of the return channel structure 24 to recover the leaked coolant.

[0078] Figure 22 shows a heat spreader B of an eleventh preferred embodiment of the present invention, which has a structure that is substantially the same as that of the ninth embodiment. The difference is that the output channel structures 23 are not provided with the support columns 233, and the first chamber support structure 60 and the second chamber support structure 70 are not provided. In addition, the peripheral capillary channel 86 is not provided. Instead, a plurality of capillary holes 241b are provided on the outer side wall 241 of the return channel structure 24 around the first chamber support structure 60. These capillary holes 241b connect the outermost capillary channel 244 with the surrounding space. These capillary holes 241b are used to draw the coolant L in the surrounding space to the capillary channel 244. Optionally, the surface 10a of the first metal plate 10 is provided with a plurality of peripheral support columns 88, which are used to support the first metal plate 10 and the second metal plate 30, and the liquid-absorbing sheet 82 is a structure that completely covers the surface 10a of the first metal plate 10.

[0079] The various designs of the heat spreader B in this embodiment can also be applied to the tenth embodiment. For example, each output channel structure 23 does not have the support columns 233; the first chamber support structure 60, the second chamber support structure 70, and the peripheral capillary channel 86 are not provided; the outer wall 241 of the return channel structure 24 is provided with a plurality of capillary holes 241b; and the liquid absorption sheet 82 is a structure that completely covers the surface 10a of the first metal plate 10.

[0080] The heat spreaders 9, A, and B of the ninth to eleventh embodiments described above can be applied to large-area heat dissipation, such as for heat dissipation of components like CPUs, GPUs, batteries, and hard drives in notebook computers, computers, and server hosts. The first metal plate 10 and the second metal plate 30 can be made of relatively thick metal plates to prevent warping. Because the metal plates are relatively thick, the output channel structure 23 does not need to be equipped with the support pillars 233, and the first chamber support structure 60 and the second chamber support structure 70...

[0081] The heat spreaders 8, 9, A, B of the eighth to eleventh embodiments described above can also be designed like the heat spreader 6 of the sixth embodiment. That is, as shown in FIG15, the channel walls 243 of the return channel structure 24, the first chamber support structure 60, and the second chamber support structure 70 are disposed on the surface 30a of the second metal plate 30.

[0082] In other embodiments, not limited to the screen printing or printing methods described above, the partition structure 20, the first chamber support structure 60, and the second chamber support structure 70 can also be formed on the first metal plate 10 and / or the second metal plate 30 by transfer printing. In other embodiments, various structures such as the partition structure 20, the first chamber support structure 60, and the second chamber support structure 70 can also be formed on the first metal plate 10 and / or the second metal plate 30 by stamping, CNC machining, or other machining methods.

[0083] It should also be noted that the printing materials in the above embodiments can also be ultraviolet-curable resins. Ultraviolet-curable resins contain resin and photosensitizers, and change from a fluid state to a solid state after being irradiated with ultraviolet light. In curing step S2, ultraviolet irradiation can be used as the curing method. That is, an ultraviolet lamp is used to emit ultraviolet light to irradiate various printed patterns on the first metal plate 10 and / or the second metal plate 30, causing the printed patterns to cure and form corresponding structures. Therefore, curing can be carried out at room temperature without heating. The printing materials in the above embodiments can also be high-temperature resistant inks, which form corresponding structures after curing. In the heat spreaders 9, A, B of the ninth to eleventh embodiments, the structure disposed on the surface 10a of the first metal plate 10 can also be manufactured by plastic injection molding; or it can be die-cast together with the first metal plate 10, for example, this method can be used when the first metal plate 10 is an aluminum alloy. In the heat spreaders 9, A, B of the ninth to eleventh embodiments, the liquid absorption member can also be made of copper powder sintered, for example, sintered on the surface 30a of the second metal plate 30 and covering the surface 10a of the first metal plate 10.

[0084] The printing materials in the above embodiments can also be a mixture of metal powder and resin. In the curing step S2, the first metal plate 10 and / or the second metal plate 30 with various printed patterns are sintered at high temperature (e.g., 800 degrees Celsius) to vaporize the resin and cure the printed patterns to form a porous metal structure.

[0085] The liquid-absorbing components in the above embodiments can absorb coolant, thereby assisting the coolant in returning to the first chamber. These components can also be installed in the first chamber 211, the confluence section 231 and acceleration section 232 of the output channel structure 23, the second chamber 221, and the capillary channel 244 of the return channel structure 24. In some embodiments, as in the eleventh embodiment, they can extend to the periphery of the aforementioned structures, fully covering the area between the first metal plate 10 and the second metal plate 30. In other embodiments, liquid-absorbing components may not be required, yet vapor can still flow from the first chamber 211 into the confluence section 231 of the output channel structure 23. The vapor is then transferred to the second chamber 221 via the acceleration section 232 of the output channel structure 23, where it condenses into droplets. These droplets are then guided back to the first chamber 211 through the return channel structure 24.

[0086] In addition, the confluence section 231 and acceleration section 232 of the output channel structure 23 can be supported by a support column 233 or by a long, straight or curved channel wall.

[0087] The above description is only a preferred embodiment of the present invention. Any equivalent changes made by applying the present invention specification and the claims should be included within the patent scope of the present invention.

[0088] 1~9, A, B: Heat exchange plates 10: First Metal Plate 10a: Surface 11: First hollow area 20: Separation Structure 21: First cavity wall structure 211: First Chamber 211a: Main chamber 211b: Branch Channel 211b1: Branch entry point 211b2: Branch exit end 212: First Export Section 213: First Entrance 22: Second cavity wall structure 221: Second Chamber 222: Second Entrance 223: Second Export Department 23: Output Channel Structure 23a: First end 23b: Second end 231: Convergence segment 232: Acceleration Section 232a: Throat 232b: Expansion section 233: Support column 233a: Arc end 233b: Tip 24: Return channel structure 241: Lateral wall 241a: Pressure relief hole 241b: capillaries 242: Inner wall 243: Passage Wall 244: Capillary Channel 244a: Entry point 244b: Export end 30: Second metal plate 30a: Surface 31: Second hollow area 40: First Webpage 50: Second mesh 60: First chamber support structure 61: First convex post 62: Support column 62a: Arc end 62b: Tip 70: Second chamber support structure 71: Second convex pillar 72: Support column 72a: Arc end 72b: Tip 80: Hollowed-out area 82: Liquid Absorption Tablet 821: First paragraph 822: Second paragraph 823: Third paragraph 824: Fourth paragraph 84: External Support Structure 842: Chamber 86: Peripheral capillary channels 86a: Entry point 86b: Export end 88: External support column 200: Cooling device L: Coolant S1: Printing Steps S2: Curing Step S3: Assembly Steps O1: First Pattern Web Version O11: Mesh area of ​​the first cavity wall O12: Mesh area of ​​the second cavity wall O13: Output channel mesh area O14: Return Flow Channel Mesh Area O2,O2': Second Pattern (Network Version) O21, O22': Mesh area of ​​the second chamber support structure O3: Third Pattern Web Version O31, O21': Mesh area of ​​the first chamber support structure P1: First Printed Pattern P11: Pattern of the first cavity wall P12: Pattern of the second cavity wall P13: Output Channel Pattern P14: Return Channel Pattern P2, P2': Second printed pattern P21, P22': Second chamber support pattern P3: Third Printing Pattern P31, P21': Support pattern for the first chamber G1: Print Header H: Heat source D,D1,D2,D3,D4,D5,D6,D7: Spacing

Claims

1. A heat spreader, comprising: a first metal plate having a surface; a second metal plate having a surface, wherein the periphery of the second metal plate is joined to the periphery of the first metal plate, and the surface of the second metal plate faces the surface of the first metal plate; and a partition structure disposed between the surface of the first metal plate and the surface of the second metal plate, the partition structure comprising a first cavity wall structure, a second cavity wall structure, an output channel structure, and a return channel structure, wherein: The area surrounded by the first cavity wall structure includes a first chamber having a first outlet and a first inlet; the area surrounded by the second cavity wall structure includes a second chamber having a second inlet and a second outlet; the output channel structure has a first end and a second end, the first end communicating with the first outlet of the first chamber, and the second end communicating with the second inlet of the second chamber; wherein, the output channel structure includes a confluence section and an acceleration section, one end of the confluence section forming the first end and communicating with the first outlet of the first chamber, the other end of the confluence section communicating with one end of the acceleration section, the width of the confluence section gradually narrowing from the direction away from the first outlet; the acceleration section includes an expansion section having the second end, the width of the expansion section gradually widening towards the second inlet of the second chamber; The reflux channel structure has a plurality of capillary channels, each capillary channel having an inlet end connected to the second outlet of the second chamber and an outlet end connected to the first inlet of the first chamber; wherein, the output channel structure includes a support structure located between the confluence section and the acceleration section; wherein, the support structure includes a plurality of support columns, each support column having an arc end and a pointed end, the arc end facing the first chamber and the pointed end facing the second chamber.

2. The heat spreader as claimed in claim 1, wherein the acceleration section includes a throat connected between the expansion section and the confluence section, the width of the throat being smaller than the width of the confluence section, and the width of the expansion section gradually widening from the throat toward the second inlet of the second chamber.

3. The heat spreader as described in claim 2, wherein the degree to which the width of the confluence section gradually narrows is more abrupt than the degree to which the width of the expansion section gradually widens.

4. The heat spreader as claimed in claim 1, wherein the first chamber includes a main chamber and a branch channel, the main chamber has the first outlet, the branch channel is located on one side of the main chamber, the two ends of the branch channel are respectively connected to the main chamber, and the first inlet is formed between the two ends of the branch channel.

5. The heat spreader as described in claim 4, wherein the end of the branch channel closer to the first outlet is defined as a branch inlet end, and the end farther from the first outlet is defined as a branch outlet end, the width of the branch inlet end is greater than the width of the branch outlet end, and the width of the branch channel gradually decreases from the branch inlet end to the branch outlet end.

6. The heat spreader as described in claim 4, wherein the width of the outlet end of each capillary channel is smaller than the width of the inlet end.

7. The heat spreader as claimed in claim 1, comprising a first chamber support structure located in the first chamber; the first chamber support structure comprising a plurality of support columns, each of the support columns having an arc end and a pointed end, the pointed end of the first chamber support structure facing the confluence section of the output channel structure.

8. The heat spreader as claimed in claim 1, comprising a second chamber support structure located in the second chamber; the second chamber support structure comprising a plurality of support columns, each of the support columns having an arc end and a pointed end, the arc end of the second chamber support structure facing the acceleration section of the output channel structure.

9. The heat spreader as claimed in claim 1, wherein the partition structure includes a peripheral support structure located around the first cavity wall structure, the second cavity wall structure, the output channel structure, and the return channel structure and supported by the first metal plate and the second metal plate.

10. The heat spreader as described in claim 9, wherein the peripheral support structure has a plurality of chambers.

11. The heat spreader as claimed in claim 1, wherein the return channel structure surrounds the periphery of the first cavity wall structure, the second cavity wall structure and the output channel structure.

12. The heat spreader as claimed in claim 11, wherein the partition structure further includes a plurality of peripheral capillary channels located on the periphery of the return channel structure and connected to the outermost one of the capillary channels.

13. The heat spreader as claimed in claim 11, wherein the reflux channel structure has an outer side wall having a plurality of capillary pores disposed around the first cavity wall structure, the capillary pores communicating with the outermost one of the capillary channels.

14. The heat spreader as claimed in claim 1, including a liquid absorber, is laid at least in the first chamber and the second chamber.

15. The heat spreader as claimed in claim 14, wherein the liquid absorber includes a liquid absorbent sheet, the liquid absorbent sheet including a first segment, a second segment and a third segment, the first segment, the second segment and the third segment respectively laid in the capillary channels of the first chamber, the second chamber and the return channel structure.

16. The heat spreader as described in claim 15, wherein the absorbent sheet is made of fiber material.

17. The heat spreader as claimed in claim 15, wherein the absorbent sheet includes a fourth section laid in the confluence section of the output channel structure.

18. The heat spreader as claimed in claim 14, wherein the liquid absorber comprises two liquid absorbent sheets respectively disposed in the first chamber and the second chamber.

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