Measuring device and measuring method

TW202640124APending Publication Date: 2026-10-01KOBELCO RES INST INC
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Patent Information

Application Number
TW115100594
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-06
Filing Date
2026-01-07
Publication Date
2026-10-01

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Abstract

The radial end position of the adhesive layer can be determined by the infrared image measurement unit. When the measurement value is located on the radial center side of the wafer compared to the reference position set based on the beveled processing part of the wafer, the measurement value is obtained by the infrared image measurement unit. When the measurement value is the same as the reference position or located on the radial outside of the wafer, the measurement value is obtained by the infrared image measurement unit.
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