Test apparatus and methods of operating and manufacting the same
TW202640148APending Publication Date: 2026-10-01TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information
- Application Number
- TW114118671
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-28
- Filing Date
- 2025-05-19
- Publication Date
- 2026-10-01
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Figure TWG2TA001078150_001 
Figure TWG2TA001078150_002 
Figure TWG2TA001078150_003
Abstract
A test apparatus may be operated by: providing a bonded assembly of a proximal interface substrate and a distal interface substrate, wherein the proximal interface substrate includes a silicon layer, first metal interconnect structures, and probe contact pads, and the distal interface substrate includes a high-hardness dielectric layer and second metal interconnect structures, the high-hardness dielectric layer has a Vickers hardness greater than
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