Chuck for die level testing

TW202640151APending Publication Date: 2026-10-01SEMICS INC
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Patent Information

Application Number
TW114150220
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-07-02
Filing Date
2025-12-19
Publication Date
2026-10-01

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    Figure TWG2TA001078862_003
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Abstract

A chuck for grain level testing includes: a movable chuck, a chuck base disposed below the movable chuck and supporting the movable chuck, and a temperature sensor disposed inside the movable chuck. none
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