Cleaning equipment and method thereof

Abstract

A cleaning equipment and method thereof, which is provided with a telescopic module, an optical module and a laser module on a machine platform, wherein the telescopic module can protrude above a socket, and the optical module is arranged on the telescopic module. When the laser module sends laser beam, it can be guided to the top of the socket by the optical module, and then the laser beam is used to clean the plurality of probes of the socket, thereby avoiding the time-consuming and human resources problems caused by the conventional manual replacement of socket and cleaning operation.

Description

[Technical Field]

[0001] This invention relates to a cleaning device, and more particularly to a cleaning device and method for a probe. [Previous Technology]

[0002] In the electrical testing of semiconductors, the test object, such as a semiconductor package or a chip, is placed into a test socket with multiple probes. After each probe contacts the electrical connection pad or solder ball of the test object, the test signal is transmitted to the test object through each probe to achieve the purpose of testing.

[0003] However, as shown in Figure 1A, after a large number of uses, dirt 12 will accumulate at the contact points of the probe 11, leading to poor contact. If testing continues, the solder balls 13 will be damaged (as shown in Figure 1B). Therefore, quality control personnel need to stop the machine and replace the test sockets, which is not only time-consuming, but also requires warehouse personnel to clean the replaced test sockets, consuming manpower and seriously slowing down the testing progress.

[0004] Therefore, how to overcome the problems of the aforementioned conventional technology has become an urgent issue to be addressed. [Summary of the Invention]

[0005] In view of the various deficiencies of the prior art, the present invention provides a cleaning device for cleaning a test socket having a plurality of probes, comprising: a machine base; a telescopic module disposed on the machine base and movable relative to the machine base to protrude from the machine base; an optical module disposed in the telescopic module; and a laser module disposed on the machine base and providing a laser beam through the optical module to the test socket.

[0006] The present invention further provides a cleaning method for cleaning a test socket having a plurality of probes, comprising: providing a cleaning device including a machine base, a telescopic module disposed on the machine base and movable relative to the machine base to protrude from the machine base, an optical module disposed in the telescopic module, and a laser module disposed on the machine base to provide a laser beam to the optical module; causing the telescopic module to protrude from the machine base and be positioned above the test socket; and causing the laser module to provide a laser beam, and the optical module to guide the laser beam to clean the plurality of probes.

[0007] The aforementioned cleaning equipment and method further include turning off the laser module after cleaning the plurality of probes.

[0008] The aforementioned cleaning equipment and method further include retracting the telescopic module for storage in the machine.

[0009] In the aforementioned cleaning equipment and method, the machine can move in three dimensions.

[0010] In the aforementioned cleaning equipment and method, the telescopic module has a cavity for accommodating the optical module.

[0011] In the aforementioned cleaning equipment and method, the optical module includes a first optical lens, a second optical lens and a third optical lens, wherein the first optical lens is disposed on the machine base and the second optical lens and the third optical lens are disposed on the telescopic module.

[0012] In the aforementioned cleaning equipment and method, the first optical lens is a reflector, the second optical lens is a focusing lens, and the third optical lens is a reflector.

[0013] Therefore, the cleaning equipment and method disclosed in this invention mainly consist of a telescopic module, an optical module, and a laser module on a three-dimensionally movable machine platform. The telescopic module can extend above the test base, and the optical module is disposed on the machine platform and the telescopic module. When the laser module sends a laser beam, it can be guided to the top of the test base by the optical module, thereby using the laser beam to clean the multiple probes of the test base. This avoids the time and manpower problems caused by conventional manual replacement of test bases and cleaning operations, and thus accelerates the progress of the testing operation. [Simplified Explanation of the Diagram]

[0032] Figures 1A and 1B are schematic diagrams of conventional probe contamination leading to solder ball damage.

[0033] Figures 2 to 5 are schematic diagrams of the cleaning equipment and method of the present invention.

Implementation Method

[0014] The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0015] It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings of this specification are only used to complement the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modification to the structure, change in the proportional relationship, or adjustment of the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed in the present invention. At the same time, the terms such as "above," "first," "second," and "a" used in this specification are only for the clarity of description and are not intended to limit the scope of the present invention. Changes or adjustments in their relative relationships, without substantially altering the technical content, should also be considered within the scope of the present invention.

[0016] Please refer to Figures 2 to 5, which are schematic diagrams of the cleaning equipment and method of the present invention.

[0017] First, a cleaning device 2 is provided for cleaning a testing device, which includes a platform 21, a telescopic module 22, an optical module 23 and a laser module 24.

[0018] The machine tool 21 can move in three dimensions, as shown in the figure, moving along the X-axis (left and right), moving along the Y-axis (front and back), and moving along the Z-axis (up and down).

[0019] The telescopic module 22 is disposed on the machine base 21 and has a chamber 220, which can move relative to the machine base 21, thereby moving out of the machine base 21 or moving into the machine base 21.

[0020] The optical module 23 is disposed in the machine base 21 and the telescopic module 22, and includes a first optical lens 231, a second optical lens 232 and a third optical lens 233. The first optical lens 231 is disposed on the machine base 21, and the second optical lens 232 and the third optical lens 233 are disposed on the telescopic module 22. In this embodiment, the second optical lens 232 and the third optical lens 233 are disposed at opposite ends of the cavity 220 of the telescopic module 22. For example, the first optical lens 231 is a reflector, the second optical lens 232 is a focusing lens, and the third optical lens 233 is a reflector. The second optical lens 232 is located between the first optical lens 231 and the third optical lens 233.

[0021] The laser module 24 is mounted on the machine base 21 and is used to provide a laser beam to the optical module 23.

[0022] The testing device is, for example, a test base 31 containing a plurality of probes 32. The test base 31 has a first surface 311 and a second surface 312 opposite to each other and a plurality of positioning holes 313 connecting the first surface 311 and the second surface 312, and the plurality of probes 32 are disposed in the plurality of positioning holes 313 of the test base 31.

[0023] Furthermore, the test socket 31 can be connected to a cavity 33, which provides a test environment. A robotic arm can be used to move the component under test (DUT) into the cavity 33 and onto the first surface 311 of the test socket 31 for subsequent electrical testing. For example, the DUT can be moved into the cavity 33 using a picking / adsorption method to perform electrical testing in a pre-defined test environment. The DUT can be, for example, an active component, a passive component, or a packaged module. The test socket 31 can also be connected to an electronic carrier board 34, which receives / transmits test information.

[0024] After prolonged use, the test socket 31 may become dirty due to contact and pressure with the component under test. This may cause test errors or make the test impossible, or even damage the component under test.

[0025] In practical applications, when the average yield of the component under test is lower than the set value, the cleaning equipment 2 can be started manually or automatically.

[0026] First, as shown in FIG2, the cleaning device 2 is moved to the vicinity of the test seat 31 by means of the machine 21, and the telescopic module 22 protrudes from the machine 21 and is positioned above the test seat 31.

[0027] As shown in Figure 3, the laser module 24 then provides a laser beam to the optical module 23. The laser beam b is first emitted to the first optical lens 231 on the machine 21, and then reflected by the first optical lens 231 to the second optical lens 232 at one end of the telescopic module 22 (chamber 220). The laser beam is then focused by the second optical lens 232 and transmitted to the third optical lens 233 at the other end of the telescopic module 22 (chamber 220). The laser beam is then reflected by the third optical lens 233 to the test socket 31. The third optical lens 233 can be positioned directly above the test socket 31 by the operation of the telescopic module 22, so as to use the laser beam to clean the surface of the probe 32 of the test socket 31. At the same time, the machine 21 is moved to clean multiple probes 32 in sequence.

[0028] As shown in Figure 4, after the complex probes 32 have been cleaned, the laser module 24 is turned off to stop the output of the laser beam.

[0029] As shown in Figure 5, the telescopic module 22 is then retracted and stored in the machine base 21, and the cleaning equipment 2 can be moved to a specific position for standby by the machine base 21.

[0030] In summary, the cleaning equipment and method of the present invention mainly includes a telescopic module, an optical module, and a laser module on a three-dimensionally movable machine platform. The telescopic module can extend above the test base, and the optical module is disposed on the machine platform and the telescopic module. When the laser module sends a laser beam, it can be guided to the top of the test base by the optical module, and then the laser beam is used to clean the multiple probes of the test base. This avoids the time and manpower problems caused by conventional manual replacement of test bases and cleaning operations, and thus accelerates the progress of the testing operation.

[0031] The above embodiments are used to illustrate the principles and effects of the present invention, and are not intended to limit the present invention. Any person skilled in the art can modify the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be as set forth in the following patent claims.

Claims

1. A cleaning apparatus for cleaning a test socket having a plurality of probes, comprising: Machine tool; A telescopic module is mounted on the machine base and can move relative to the machine base to protrude from and retract into the machine base; An optical module is disposed in the telescopic module; and a laser module is disposed on the machine and provides a laser beam through the optical module to the test stand.

2. The cleaning equipment as described in claim 1, wherein, The machine platform moves in three dimensions.

3. The cleaning equipment as described in claim 1, wherein, The telescopic module has a cavity for housing the optical module.

4. The cleaning equipment as described in claim 1, wherein, The optical module includes a first optical lens, a second optical lens and a third optical lens, with the first optical lens mounted on the machine base and the second and third optical lenses mounted on the telescopic module.

5. The cleaning equipment as described in claim 4, wherein, The first optical lens is a reflector, the second optical lens is a focusing lens, and the third optical lens is a reflector.

6. The cleaning equipment as described in claim 1, wherein, The telescopic module protrudes above the multiple probes to clean them using the laser beam.

7. A cleaning method for cleaning a test socket having a plurality of probes, comprising: A cleaning apparatus is provided, comprising a machine base, a telescopic module disposed on the machine base and movable relative to the machine base to protrude and retract into the machine base, an optical module disposed in the telescopic module, and a laser module disposed on the machine base to provide a laser beam to the optical module; the telescopic module protrudes from the machine base and is positioned above the test base; and the laser module provides a laser beam, which is guided by the optical module to clean the plurality of probes.

8. The cleaning method as described in claim 7 further includes turning off the laser module after cleaning the plurality of probes.

9. The cleaning method as described in claim 8 further includes retracting the telescopic module for storage in the machine.

10. The cleaning method as described in claim 7, wherein, The machine platform moves in three dimensions.

11. The cleaning method as described in claim 7, wherein, The telescopic module has a cavity for housing the optical module.

12. The cleaning method as described in claim 11, wherein, The optical module includes a first optical lens, a second optical lens and a third optical lens, with the first optical lens mounted on the machine base and the second and third optical lenses mounted on the telescopic module.

13. The cleaning method as described in claim 12, wherein, The first optical lens is a reflector, the second optical lens is a focusing lens, and the third optical lens is a reflector.

Images