Device and method for epoxy-free optical integration in photonic integrated circuits

Abstract

A method and assembly for forming a photonic integrated circuit (PIC) with epoxy-free hybrid bonding of optical and electronic components may be provided. The method may include providing a silicon wafer with a buried oxide layer, silicon waveguide, and backend metal layers, forming an opening to expose a nitride waveguide facet, and hybrid bonding a lower body reflector (LBR) within the opening. A handle silicon wafer may be attached, and a conformal oxide layer may be deposited and planarized. Through-dielectric vias (TDVs) or through-silicon vias (TSVs) may be formed for vertical electrical connectivity. An electronic integrated circuit (EIC) may be hybrid bonded over the oxide layer. The resulting PIC assembly may include the LBR and EIC bonded without epoxy, providing robust optical alignment, electrical interfacing, and thermal stability. The assembly may minimize air gaps to ensure optical continuity and may incorporate TDVs or TSVs for enhanced electrical integration.

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