Hybrid-bonded face-to-back photonic architecture

Abstract

Described herein are techniques for light extraction in hybrid-bonded photonics packages, in which application-specific integrated circuits (ASICs) are attached to a photonic integrated circuit (PIC) via hybrid-bonding. The techniques developed by the inventors involve extraction of light from the backside of the PIC, as opposed to the top side or the edge of the PIC as in conventional devices. A photonic device comprises a substrate, a PIC, an ASIC and an optical assembly. The PIC is disposed on the substrate and has a first surface and a second surface. The first surface faces the substrate. The ASIC is hybrid-bonded to the second surface of the PIC. The optical assembly comprises a fiber array unit and an optical fiber. The optical assembly is disposed in an opening formed in the substrate and the optical assembly is configured to receive light through the first surface of the PIC.

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