Photosensitive composition, cured product, method for producing cured product, display device, touch panel, polymer, and compound
TW202640299APending Publication Date: 2026-10-01JSR CORPORATION
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Patent Information
- Application Number
- TW115108863
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-12
- Filing Date
- 2026-03-11
- Publication Date
- 2026-10-01
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Figure TWG2TA001079497_001 
Figure TWG2TA001079497_002
Abstract
This invention provides a photosensitive composition that yields a cured product with excellent solvent resistance while being patternable through low-temperature curing. The photosensitive composition is used to form a cured resin layer in a light-emitting device, the light-emitting device including a substrate, a light-emitting element, a sealing layer, and a cured resin portion having the cured resin layer. The photosensitive composition contains: compound (A) having a specific heterocyclic structure, the specific heterocyclic structure being at least one selected from the group consisting of an azole ring structure and a condensed ring structure of an azole ring and an aromatic ring; and a polymerization initiator. The photosensitive composition further contains a compound (C) having one or more of (meth)acrylic, oxetyl, and oxetyl groups and not having a specific heterocyclic structure, or compound (A) comprising a compound (A1) having one or more of (meth)acrylic, oxetyl, and oxetyl groups and a specific heterocyclic structure, or compound (A) comprising compound (A1) and further comprising compound (C).
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