Methods for forming photosensitive elements, photoresist patterns, and conductor patterns

Abstract

The present invention aims to provide a photosensitive element with high adhesion and high resolution, capable of obtaining a photoresist pattern with excellent rectangularity, a method for forming the photoresist pattern, and a method for manufacturing a conductor pattern. The photosensitive element of the present invention has a laminated structure comprising a support film, an intermediate layer, and a photosensitive resin layer in sequence; and the aforementioned photosensitive resin layer contains a photosensitive resin composition; the aforementioned photosensitive resin composition contains: (A) an adhesive polymer, (B) a photopolymerizable compound with ethylene unsaturated bonds, (C) a photopolymerization initiator, (D) a photosensitizer, and (E) a polymerization inhibitor; the reactive double bond equivalent in the aforementioned (A) adhesive polymer is 0.215 mmol / g or less relative to the total mass of the aforementioned adhesive polymer; and the aforementioned (D) photosensitizer contains a compound with an anthracene skeleton.

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