Methods for manufacturing patterned resin layers, methods for manufacturing wiring layers, methods for manufacturing multilayers, multilayers, electronic devices

Abstract

The objective of this invention is to provide a method for manufacturing a patterned resin layer, which can pattern a resin layer on a substrate that does not have photosensitive function with high resolution, and can also achieve simple patterning without the use of a hard mask. The solution is a method for manufacturing a patterned resin layer that includes at least the following first to third steps in sequence. 1) First step: forming a resin layer (A) on a substrate comprising one or more resins selected from the group consisting of polyimide resin, polybenzoxazole resin, polyamide resin (wherein the polyamide resin does not contain polyimide precursors and polybenzoxazole precursors), polyether resin, polyester resin, and copolymers thereof. 2) Second step: forming a silicate layer (B) by coating the resin layer (A) with a photosensitive silicate material and drying it, and then patterning the silicate layer (B) by exposure and development. 3) The third step is to etch the resin layer (A) by dry etching in an environment containing at least 50% by volume of oxygen, using a silicate layer (B) as a mask.

Images