Exposure apparatus, processing apparatus and positioning unit

Abstract

An exposure apparatus, processing apparatus, and positioning unit are provided that can reliably fix even a defective workpiece through vacuum suction. To achieve the aforementioned objective, one embodiment of the exposure apparatus includes a peripheral guide, a pushing guide, a workpiece stage, and a light source. The peripheral guide has a guiding surface with a shape consistent with the second periphery of a workpiece having a defective wafer and a first periphery (due to the defect) and a second periphery (other than the first periphery). The pushing guide pushes the first periphery, causing the second periphery to slide relative to the guiding surface, thereby positioning the workpiece relative to the peripheral guide. The workpiece stage vacuum-suctions the workpiece. The light source exposes the workpiece vacuum-suctioned by the workpiece stage.

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