A method for lithographic exposure of a substrate, a lithographic exposure system for carrying out such a method, and a computer program element

TW202640311APending Publication Date: 2026-10-01EV GRP E THALLNER GMBH
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Patent Information

Application Number
TW115110765
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-24
Filing Date
2026-03-20
Publication Date
2026-10-01

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Abstract

to be created by the exposure when the functional units are in their target positions, measuring the substrate with the functional units with a measuring device for the determination of the actual positions of the functional units, dividing the substrate into zones, in particular with at least one functional unit, determining a deviation between the actual positions and the target positions for the functional units and / or zones by means of an analysis device, and primarily adapting the exposure plan to the deviation between the actual position and the target position with regard to the structure to be created in the region
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