An inspection method for semiconductor wafers, a non-transitory computer-readable recording medium, and an inspection method used in advanced pachaging processes

TW202640540APending Publication Date: 2026-10-01UTECHZONE CO LTD
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Patent Information

Application Number
TW114111141
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-03-25
Publication Date
2026-10-01

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Abstract

The present disclosure provides an inspection method for semiconductor wafers, comprising the following steps: marking a via feature in an object image; defining a region of interest (ROI) around the via feature based on the center of the via feature; and calculating a grayscale difference value by subtracting the minimum grayscale value from the maximum grayscale value within the ROI;determining whether the ROI has comet tail characteristics based on the grayscale difference value. ​
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