Metal plate microresistors

Abstract

A metal plate microresistor includes an alloy resistive block, two heat dissipation layers spaced apart from each other on the alloy resistive block, and two electrode blocks formed on the alloy resistive block and the heat dissipation layers. The alloy resistive block includes a first surface and a second surface located on opposite sides, and two side surfaces respectively connected to the first surface and the second surface. The heat dissipation layers are spaced apart on the first surface. The electrode blocks are formed on the side surfaces, the second surface, and the heat dissipation layers. Each electrode block includes a side connection formed on a particular side surface, and a first portion extending from the side connection and attached to the heat dissipation layer on the same side. The heat dissipation layers are directly attached to the alloy resistive block, thereby increasing the heat dissipation area of ​​the alloy resistive block and improving thermal conductivity.

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