Method for removing by-product in plasma etching apparatus
TW202640694APending Publication Date: 2026-10-01TSMC CHINA COMPANY +1
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Patent Information
- Application Number
- TW114120190
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-19
- Filing Date
- 2025-05-29
- Publication Date
- 2026-10-01
Smart Images
Figure TWG2TA001078173_001 
Figure TWG2TA001078173_002 
Figure TWG2TA001078173_003
Abstract
A method includes following steps. A pressure within a chamber is reduced from a first pressure level to a second pressure level using a first pump. After reducing the pressure within the chamber to the second pressure level, a plasma etching operation is performed in the chamber. After performing the plasma etching operation, a pneumatic purging apparatus is placed onto the first pump. After placing the pneumatic purging apparatus onto the first pump, an interior space of the first pump is purged by ejecting a purging gas from the pneumatic purging apparatus.
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