Thermal solutions for high frequency and high power transmission

TW202640695APending Publication Date: 2026-10-01APPLIED MATERIALS INC
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Patent Information

Application Number
TW114136920
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-11
Filing Date
2025-09-25
Publication Date
2026-10-01

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Abstract

Embodiments described herein relate to an apparatus that includes a housing, and a core within the housing. In an embodiment, a channel is set into an outer surface of the core, and a first hole passes through the core. In an embodiment, the apparatus further includes an inlet through the housing, where the inlet is fluidly coupled to the channel, and an outlet through the housing, where the outlet is fluidly coupled to the channel. In an embodiment, the apparatus further includes a dielectric plug within the first hole, where a second hole passes through the dielectric plug.
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