Plasma treatment unit

TW202640704APending Publication Date: 2026-10-01TOKYO ELECTRON LTD
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Patent Information

Application Number
TW114147523
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-04-14
Filing Date
2025-12-04
Publication Date
2026-10-01

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Abstract

The plasma processing apparatus disclosed in this invention comprises: a plasma processing chamber; a substrate support; a dielectric window disposed above the substrate support, having an opening through the dielectric window in its central portion; a gas injector extending through the opening of the dielectric window and mounted in the central portion of the dielectric window; an antenna disposed to surround the gas injector; an RF power supply electrically connected to the antenna; a shielding box having a top plate disposed above the dielectric window and a side wall extending from the top plate to the dielectric window, housing the antenna within a shielding space divided by the dielectric window, the top plate, and the side wall, wherein the top plate has at least one air inlet and the side wall has at least one exhaust outlet; and at least one fan mounted on the top plate at at least one air inlet.
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