Electrostatic chuck device and method for manufacturing electrostatic chuck device

Abstract

An electrostatic chuck device is provided, comprising: an electrostatic chuck component having electrodes inside; a temperature adjustment base component; and a bonding layer connecting the electrostatic chuck component and the temperature adjustment base component. In the electrostatic chuck device, the bonding layer comprises spherical filler and resin. The filler comprises a first filler and a second filler. The thermal conductivity of the first filler is 180 W / (m·K) or higher, and the thermal conductivity of the second filler is 180 W / (m·K) or higher. The primary particle size of the first filler is 2 μm or higher and less than 15 μm, and the primary particle size of the second filler is 15 μm or higher and less than 50 μm. The total content of the first filler and the second filler in the bonding layer is 50% by volume or higher and 90% by volume or lower, and the content of the first filler relative to the total content of the first filler and the second filler is 10% by volume or higher and 50% by volume or lower.

Images