Wide-coverage edge ring for enhanced shielding in substrate processing systems

Abstract

A wide-coverage edge ring configured to be arranged above a bottom ring in a substrate processing chamber includes an upper surface, a lower surface that includes a lower surface step that extends downward from the lower surface and is configured to be received within and interface with a pocket defined at least partially by an upper surface of the bottom ring and an inner surface of a chamber liner, an inner diameter, a ledge defined in the inner diameter of the edge ring, and an outer diameter. The outer diameter of the edge ring includes a projection that extends radially outward from the edge ring and defines an inward step in the outer diameter, the projection and the inward step are configured to interface with an upper end of the chamber liner, and the projection is configured to extend at least partially over the upper end of the chamber liner.

Images