Power delivery module
TW202640796APending Publication Date: 2026-10-01CYNTEC
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Patent Information
- Application Number
- TW114141630
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-10-27
- Filing Date
- 2025-10-28
- Publication Date
- 2026-10-01
Smart Images
Figure TWG2TA001078382_001 
Figure TWG2TA001078382_002 
Figure TWG2TA001078382_003
Abstract
A heat dissipation structure is disposed between two busbars or disposed outside the busbar, so as to dissipate heat from the busbar. In an embodiment, the heat dissipation structure is disposed between two busbars, such that a single heat dissipation structure is used to dissipate heat from two busbars simultaneously, so as to reduce cost of the heat dissipation structure. Furthermore, an insulation member is disposed between the two busbars and / or disposed between the busbar and the heat dissipation structure to achieve electrical insulation.
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