A structure of ribbon planar transducer for earphones
TW202640908APending Publication Date: 2026-10-01BESTON TECH CORP
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Patent Information
- Application Number
- TW114110703
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-03-21
- Publication Date
- 2026-10-01
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Figure TWG2TA001077704_001 
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Abstract
The invention provides a structure of a ribbon planar earphone transducer, including a composite diaphragm, and the diaphragm may be secured by two fixing plates on both its upper and lower sides or by a single fixing plate on one side; magnets are respectively arranged on the upper and lower sides or one side of the composite diaphragm, and magnets are arranged on both the upper and lower sides or on one side of the composite diaphragm, with the magnets respectively fixed to two frames or a single frame, which has openings. The composite diaphragm includes a first polyimide insulation layer; a metal conductor layer, arranged above the first polyimide insulation layer; a second insulation layer, arranged above the metal conductor layer. The water absorption of the second insulation layer material must be lower than that of the first polyimide insulation layer. At the same time, the average outer edge size of the second insulation layer must be maintained between
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