A structure of ribbon planar transducer for earphones

TW202640908APending Publication Date: 2026-10-01BESTON TECH CORP
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Patent Information

Application Number
TW114110703
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-03-21
Publication Date
2026-10-01

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Abstract

The invention provides a structure of a ribbon planar earphone transducer, including a composite diaphragm, and the diaphragm may be secured by two fixing plates on both its upper and lower sides or by a single fixing plate on one side; magnets are respectively arranged on the upper and lower sides or one side of the composite diaphragm, and magnets are arranged on both the upper and lower sides or on one side of the composite diaphragm, with the magnets respectively fixed to two frames or a single frame, which has openings. The composite diaphragm includes a first polyimide insulation layer; a metal conductor layer, arranged above the first polyimide insulation layer; a second insulation layer, arranged above the metal conductor layer. The water absorption of the second insulation layer material must be lower than that of the first polyimide insulation layer. At the same time, the average outer edge size of the second insulation layer must be maintained between
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