MEMS microphone

TW202640911APending Publication Date: 2026-10-01LG INNOTEK CO LTD
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Patent Information

Application Number
TW114146690
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-04-15
Filing Date
2025-11-28
Publication Date
2026-10-01

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Abstract

A MEMS microphone according to the present embodiment includes: a first substrate; a second substrate disposed on the first substrate; an adhesive layer disposed between the first substrate and the second substrate; a MEMS structure disposed on the second substrate; and a capacitor disposed to be spaced apart from the MEMS structure. The capacitor includes a first external electrode and a second external electrode disposed at both ends, and a dielectric layer disposed between the first external electrode and the second external electrode. The first external electrode and the second external electrode of the capacitor are soldered to a plating region formed on the second substrate.
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