MEMS microphone

TW202640913APending Publication Date: 2026-10-01LG INNOTEK CO LTD
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Patent Information

Application Number
TW114143974
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-26
Filing Date
2025-11-11
Publication Date
2026-10-01

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    Figure TWG2TA001078477_001
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    Figure TWG2TA001078477_002
  • Figure TWG2TA001078477_003
    Figure TWG2TA001078477_003
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Abstract

According to the present embodiment, a MEMS microphone includes a first substrate; a second substrate disposed on the first substrate; an adhesive layer disposed between the first substrate and the second substrate; a MEMS structure disposed on the second substrate; a signal processing element disposed on the second substrate and spaced apart from the MEMS structure; and a capacitor disposed spaced apart from the MEMS structure and the signal processing element, in which the capacitor includes a first external electrode and a second external electrode disposed at opposite ends, a plurality of internal electrodes and a dielectric layer disposed between the first and second external electrodes, the first substrate, the second substrate, and the MEMS structure are stacked in a first direction, and the plurality of internal electrodes being stacked in a second direction perpendicular to the first direction.
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