Microelectromechanical system microphone

Abstract

This invention provides a microelectromechanical system (MEMS) microphone. The MEMS microphone includes: a substrate having a first cavity; a dielectric layer disposed on the substrate, having a first side connected to the substrate and a second side opposite to the first side, wherein the dielectric layer has a second cavity corresponding to the first cavity; a diaphragm located within the second cavity, including a bonding region, a sensing region, and an elastic structure, wherein the bonding region is connected to the dielectric layer, the sensing region includes a peripheral region and a central region, the peripheral region and the central region are connected by the elastic structure, the elastic structure has a first gap on the side near the central region, and the elastic structure has a second gap on the side near the peripheral region; and a first backplate disposed on the dielectric layer, located on the second side of the dielectric layer, wherein the first backplate includes a plurality of sound holes communicating with the second cavity, wherein the acoustic radiation efficiency of the diaphragm is greater than or equal to

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