Plasma electrode with textured backside
TW202640940APending Publication Date: 2026-10-01LAM RES CORP
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Patent Information
- Application Number
- TW114146823
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-03
- Filing Date
- 2025-12-01
- Publication Date
- 2026-10-01
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Figure TWG2TA001078613_001 
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Figure TWG2TA001078613_003
Abstract
A method for texturing a silicon electrode for a semiconductor processing chamber is presented. The silicon electrode comprises a plasma-facing side and a backside, the backside configured to contact a thermal interface material. The method comprises forming a roughened texture on the backside of the silicon electrode while not forming the roughened texture on the plasma-facing side of the silicon electrode.
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