Circuit board, electronic device and method of manufacturing the same

Abstract

A circuit board, electronic device and method of manufacturing the same are provided. The circuit board includes a flexible board, a thermal contact layer, thermoelectric materials and a voltage regulator. The flexible board includes a heat sinking layer and a thermal insulating layer. The electronic device includes the mentioned circuit board, also includes a sensors, signal processors and Radio Frequency Front End Module modules. The flexible board is a multi-layer board with each layer containing several copper circuit layers. The thermal contact layer is placed in the flexible board, and the thermal contact layer is placed under the flexible board to be used to capture and transfer heat to the thermoelectric materials. The thermoelectric materials include N-type thermoelectric materials and P-type thermoelectric materials. N-type thermoelectric materials and P-type thermoelectric materials realize electrical conduction through the copper circuit layers to generate electrical energy. The electronic device includes the mentioned circuit board, and utilizes the flexible board which helps the thermoelectric components to apply on uneven surfaces to improve the efficiency of heat and power conversion.

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